Datasheet > CGJ4J2X7R1A334K125AA_17

CGJ4J2X7R1A334K125AA_17

更新时间： 2024-11-29 01:22:59

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	241K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : December 11, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGJ4J2X7R1H333K125AA

TDK item description CGJ4J2X7R1H333KT****

Applications

Feature

High Reliability Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGJ4(2012) [EIA 0805]

Production (Not Recommended for New Design)

Size

Length(L)

2.00mm ±0.20mm

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

33nF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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