Datasheet > CGJ3E2C0G1H150J080AA_17

CGJ3E2C0G1H150J080AA_17

更新时间： 2024-11-16 01:17:31

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	184K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : December 06, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGJ3E2C0G1H150J080AA

TDK item description CGJ3E2C0G1H150JT****

Applications

Feature

High Reliability Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGJ3(1608) [EIA 0603]

Production (Not Recommended for New Design)

Size

Length(L)

1.60mm ±0.10mm

Width(W)

0.80mm ±0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

15pF ±5%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

700

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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