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CGD12HBXMP PDF预览

CGD12HBXMP

更新时间: 2024-11-24 01:25:55
品牌 Logo 应用领域
科锐 - CREE
页数 文件大小 规格书
10页 620K
描述
Dual Channel Differential Isolated Gate Driver XM3 CPM3 SiC Half-Bridge Module Companion Tool

CGD12HBXMP 数据手册

 浏览型号CGD12HBXMP的Datasheet PDF文件第2页浏览型号CGD12HBXMP的Datasheet PDF文件第3页浏览型号CGD12HBXMP的Datasheet PDF文件第4页浏览型号CGD12HBXMP的Datasheet PDF文件第5页浏览型号CGD12HBXMP的Datasheet PDF文件第6页浏览型号CGD12HBXMP的Datasheet PDF文件第7页 
VDrive  
IG  
+15/-4V  
1ꢀ ꢁ  
CGD12HBXMP  
Dual Channel Differential Isolated Gate Driver  
XM3 CPM3 SiC Half-Bridge Module Companion Tool  
RG  
1 Ω  
Technical Features  
Package  
Optimized for use with Cree’s High-  
Performance XM3 Half Bridge Power Modules  
High-Frequency, Ultra-Fast Switching  
Operation  
On-Board 2 W Isolated Power Supplies  
Primary OVLO and UVLO with Hysteresis  
On-Board Overcurrent, Shoot-Through, and  
Reverse Polarity Protection  
Differential Inputs for Increased Noise  
Immunity  
Very Low Isolation Capacitance  
Single-Ended to Differential Daughter Board  
Available Upon Request (CGD12HB00D)  
ꢁpplications  
DC Bus Voltages up to 1000 V  
Maximum Ratings  
Symbol  
Parameter  
Value  
-0.5 to 13.2  
-0.5 to 5.5  
10  
Unit  
VDC  
VI  
Supply Voltage  
Logic Level Inputs  
V
IO  
Output Peak Current (TA = 25 °C)  
A
PDrive  
Output Power per Channel (TA = 25 °C)  
2
W
Maximum Switching Frequency  
(Module & MOSFET Dependent, see Power  
Estimate Section)  
fS  
80  
kHz  
°C  
Top  
Tstg  
Ambient Operating Temperature  
-50 to 85  
-50 to 125  
Storage Temperature  
Rev. A, 2019-06-01  
CGD12HBXMP  
4600 Silicon Dr., Durham, NC 27703  
Copyright ©2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, Wolfspeed®, and the Wolfspeed logo  
are registered trademarks of Cree, Inc.  
1

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