Datasheet > CGA9N3X7R1E476M230KB_17

CGA9N3X7R1E476M230KB_17

更新时间： 2024-11-25 01:24:59

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	122K
描述
Multilayer Ceramic Chip Capacitors

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中文翻译

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CGA9N3X7R1E476M230KB_17 数据手册

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Creation Date : July 04, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA9N3X7R1E476M230KB

TDK item description CGA9N3X7R1E476MT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA9(5750) [EIA 2220]

Production

Size

5.70mm ±0.40mm

Length(L)

Width(W)

5.00mm ±0.40mm

2.30mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

4.10mm to 4.80mm

1.20mm to 1.40mm

4.00mm to 5.00mm

Electrical Characteristics

Capacitance

47μF ±20%

25VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

10MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Yes

Packing

Blister (Plastic)Taping [180mm Reel]

500pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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