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CGA6P3X7S1H106M250AE_17 PDF预览

CGA6P3X7S1H106M250AE_17

更新时间: 2024-11-24 01:21:23
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 235K
描述
Multilayer Ceramic Chip Capacitors

CGA6P3X7S1H106M250AE_17 数据手册

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1 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA6P3X7S1H106K250AE  
TDK item description CGA6P3X7S1H106KT***S  
Applications  
Feature  
Automotive Grade  
Soft Soft Termination  
AEC-Q200 AEC-Q200  
CGA6(3225) [EIA 1210]  
Production  
Series  
Status  
Size  
3.20mm +0.50,-0.40mm  
Length(L)  
Width(W)  
2.50mm ±0.30mm  
2.50mm ±0.30mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
2.00mm to 2.40mm  
1.00mm to 1.20mm  
1.90mm to 2.50mm  
Electrical Characteristics  
Capacitance  
10μF ±10%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X7S(±22%)  
5%  
50MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
Yes  
Packing  
Blister (Plastic)Taping [180mm Reel]  
1000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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