Datasheet > CGA3E2C0G1H100D080AA_17

CGA3E2C0G1H100D080AA_17

更新时间： 2024-11-24 01:25:23

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	179K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : June 22, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA3E2C0G1H100D080AA

TDK item description CGA3E2C0G1H100DT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA3(1608) [EIA 0603]

Production

Size

1.60mm ±0.10mm

Length(L)

Width(W)

0.80mm ±0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

10pF ±0.5pF

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

600

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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