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CGA3E1X7R1C474M080AC_17 PDF预览

CGA3E1X7R1C474M080AC_17

更新时间: 2024-11-10 01:19:59
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 239K
描述
Multilayer Ceramic Chip Capacitors

CGA3E1X7R1C474M080AC_17 数据手册

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1 of 3  
Creation Date : March 08, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3216X7R2J333K160AA  
TDK item description C3216X7R2J333KT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA5L4X7R2J333K160AA for Automotive use.  
Mid Mid Voltage (100 to 630V)  
Feature  
Series  
Status  
C3216 [EIA 1206]  
Production  
Size  
3.20mm ±0.20mm  
Length(L)  
Width(W)  
1.60mm ±0.20mm  
1.60mm ±0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
1.00mm Min.  
2.10mm to 2.50mm(Flow Soldering)  
2.00mm to 2.40mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
1.10mm to 1.30mm(Flow Soldering)  
1.00mm to 1.20mm(Reflow Soldering)  
1.00mm to 1.30mm(Flow Soldering)  
1.10mm to 1.60mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
33nF ±10%  
630VDC  
X7R(±15%)  
3%  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
2000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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