Datasheet > CGA2B3X7R1H223M050BB_17

CGA2B3X7R1H223M050BB_17

更新时间： 2024-11-25 01:22:23

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	237K
描述
Multilayer Ceramic Chip Capacitors

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CGA2B3X7R1H223M050BB_17 数据手册

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Creation Date : June 13, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA2B3X7R1H223M050BB

TDK item description CGA2B3X7R1H223MT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA2(1005) [EIA 0402]

Production

Size

1.00mm ±0.05mm

Length(L)

Width(W)

0.50mm ±0.05mm

0.10mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.30mm to 0.50mm

0.35mm to 0.45mm

0.40mm to 0.60mm

Electrical Characteristics

Capacitance

22nF ±20%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Yes

Packing

Punched (Paper)Taping [180mm Reel]

10000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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