CEM860
Intel® Core™ i7/i5/i3 COM Express™Type
6 Module with Intel® QM67
Features
SBC
Services
and Solutions
2nd generation Intel® Core™ processor
Intel® QM67 chipset
2 DDR3-1066/1333 SO-DIMMs max. up to 16 GB
22 lanes of PCIe Gen 2 at 5GT/s
2 SATA-600 & 2 SATA-300
8 USB 2.0 ports
2 USB 3.0 ports (optional)
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2
Systems
on
Modules
Double deck
DDR3 SO-DIMM
TPM 1.2 supported (optional)
Embedded
SBCs
>EPIC
Embedded
SBCs
>3.5" Capa
DDR3
USB
Full Solid
Rear view
DDR3
USB 3.0
DualView
Low Power
Cap Design
Packing List
System
Embedded
SBCs
>Nano-ITX
CPU
2nd generation Intel® Quad/ Dual Core™ i7/i5/i3 &
Celeron® processor
Quick installation guide, user's manual/utility CD
System Memory
2 x 204-pin SO-DIMM support DDR3-1066/1333 max.
up to 16 GB
Ordering Information
Standard
Chipset
BIOS
SSD
Watchdog Timer
Intel® QM67
AMI UEFI BIOS
N/A
CEM860DG-i5-2515E
(P/N: E380860101)
COM Express type 6 module with Intel® Core™ i5-2515E
3.1 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet, USB 3.0
and TPM (recommended cooler P/N: E39J000101)
Embedded
SBCs
>Pico-ITX
255 levels, 1~255 sec.
Expansion Interface
1 x PCIe x16 graphics port
6 x PCIe lanes support for 6 x PCIe x1 or
1 x PCIe x4 + 2 x PCIe x1 devices
CEM860DG-i3-2340UE
(P/N: E380860103)
COM Express type 6 module with Intel® Core™ i3-2340UE
1.3 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet, USB 3.0
and TPM (recommended cooler P/N: E39J000101)
Battery
Power Requirements
Size
N/A
CEM860DG-B810E
(P/N: E380860104)
COM Express type 6 module with Intel® Celeron® B810E
1.6 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet, TPM
(recommended cooler P/N: E39J000102)
Embedded
SBCs
>PC/104
Differentiate by onboard processor
125 x 95 mm
CEM860DG-i7-2715QE
(P/N: E380860100)
COM Express type 6 module with Intel® Core™ i7-2715QE
3 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet, USB 3.0
and TPM (recommended cooler P/N: E39J000100)
COM Express type 6 module with Intel® Core™ i7-2610UE
2.4 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet and TPM
(recommended cooler P/N: E39J000100)
Board Thickness
Temperature
Operation Humidity
1.6 mm
0° ~ +60°C (32°F ~ 140°F), operation
10% ~ 95% relative humidity, non-condensing
CEM860DG-i7-2610UE
(P/N: E380860102)
Industrial
Mother-boards
I/O
MIO
CEM860DG-i7-2610UE WT COM Express type 6 module with Intel® i7-2610UE 2.4 GHz,
VGA/LVDS, 10/100/1000Mbps Ethernet, TPM and W.T.
1 x LPC interface
1 x SPI interface
2 x SATA-600, 2 x SATA-300
N/A
1 port as 10/100/1000Mbps supports Wake-on-LAN,
RPL/PXE Boot ROM with Intel® 82579LM
HD link interface to baseboard for external Codec
8 x USB 2.0, 2 x USB 3.0 (optional)
Infineon SLB9635 for trusted platform (optional)
Yes
(-40° ~ +80°C) (recommended cooler P/N: E39J000100)
SATA
Hardware Monitoring
Ethernet
Slot CPU
Cards
Cooler with heatspreader
CEB94006
E39J000100
E39J000101
E39J000102
* W.T.: Wide Temperature
ATX form factor type 6 baseboard
TS000-CEM860-i7 with fan RC (up to 45W Core™ i CPU)
TS000-CEM860-i5/ i3 with fan RC (up to 35W Core™ i CPU)
TS000-CEM860-celeron with fan RC (up to 35W Core™ i CPU)
Audio
USB
TPM 1.2
SMBus
Digital I/O
ARM
Embedded
Boards
4 channels IN & 4 channels OUT
Display
Chipset
Memory Size
Display Interface
Intel® HD graphics 3000 code
Depending on integrnted GPU
1 x VGA
Accessories
1 x LVDS; 18/24-bit single/dual channel
3 x DDI (SDVO, DP, HDMI, DVI)
Appendix
axiomtek.com
78
© 2016 Axiomtek Co., Ltd. All rights reserved.
* All specifications and photos are subject to change without notice.
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