生命周期: | Active | 零件包装代码: | DIP |
包装说明: | DIP, DIP14,.3 | 针数: | 14 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 6 weeks | 风险等级: | 5.29 |
系列: | HCT | JESD-30 代码: | R-GDIP-T14 |
长度: | 19.56 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | NOR GATE | 最大I(ol): | 0.004 A |
功能数量: | 4 | 输入次数: | 2 |
端子数量: | 14 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装等效代码: | DIP14,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
包装方法: | TUBE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 最大电源电流(ICC): | 0.04 mA |
Prop。Delay @ Nom-Sup: | 32 ns | 传播延迟(tpd): | 32 ns |
认证状态: | Not Qualified | 施密特触发器: | NO |
座面最大高度: | 5.08 mm | 子类别: | Gates |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6.67 mm | Base Number Matches: | 1 |
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