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CD54AC273A

更新时间: 2024-11-20 05:08:59
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哈里斯 - HARRIS 触发器
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描述
Octal D Flip-Flop with Reset

CD54AC273A 数据手册

  
CD54AC273/3A  
CD54ACT273/3A  
S E M I C O N D U C T O R  
COMPLETE DATA SHEET  
COMING SOON!  
Octal D Flip-Flop with Reset  
June 1997  
Description  
Functional Diagram  
CLOCK  
CP  
The CD54AC273/3A and CD54ACT273/3A are octal D flip-  
flops with reset that utilize the Harris Advanced CMOS Logic  
technology. Information at the D input is transferred to the Q  
output on the positive-going edge of the clock pulse. All eight  
flip-flops are controlled by a common clock (CP) and a com-  
mon reset (MR). Resetting is accomplished by a low-voltage  
level independent of the clock.  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
DATA  
INPUTS  
DATA  
OUTPUTS  
The CD54AC273/3A and CD54ACT273/3A are supplied in  
20 lead dual-in-line ceramic packages (F suffix).  
ACT INPUT LOAD TABLE  
INPUT  
Dn  
UNIT LOAD (NOTE 1)  
0.5  
0.57  
1
MR  
RESET MR  
CP  
NOTE:  
1. Unit load is I limit specified in DC Electrical Specifications  
CC  
o
Table, e.g., 2.4mA Max at +25 C.  
Absolute Maximum Ratings  
DC Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6V  
Power Dissipation Per Package, P  
CC  
D
o
o
DC Input Diode Current, I  
T = -55 C to +100 C (Package F) . . . . . . . . . . . . . . . . . . 500mW  
IK  
A
o
o
For V < -0.5V or V > V + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA  
T = +100 C to +125 C (Package F) . . . . . . . . Derate Linearly at  
I
I
CC  
A
o
DC Output Diode Current, I  
8mW/ C to 300mW  
OK  
For V < -0.5V or V > V + 0.5V. . . . . . . . . . . . . . . . . . . . .±50mA Operating Temperature Range, T  
O
O
CC  
A
o
o
DC Output Source or Sink Current, Per Output Pin, I  
Package Type F. . . . . . . . . . . . . . . . . . . . . . . . . .-55 C to +125 C  
O
o
o
For V > -0.5V or V < V + 0.5V. . . . . . . . . . . . . . . . . . . . .±50mA  
Storage Temperature, T  
. . . . . . . . . . . . . . . . . .-65 C to +150 C  
O
O
CC  
STG  
DC V or GND Current, I or I  
Lead Temperature (During Soldering)  
CC  
CC  
GND  
For Up to 4 Outputs Per Device, Add ±25mA For Each  
Additional Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±100mA  
At Distance 1/16in. ± 1/32in. (1.59mm ± 0.79mm)  
From Case For 10s Max . . . . . . . . . . . . . . . . . . . . . . . . . . +265 C  
Unit Inserted Into a PC Board (Min Thickness 1/16in., 1.59mm)  
o
o
With Solder Contacting Lead Tips Only. . . . . . . . . . . . . . . +300 C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Recommended Operating Conditions  
o
o
Supply Voltage Range, V  
Operating Temperature, T . . . . . . . . . . . . . . . . . . .-55 C to +125 C  
CC  
A
Unless Otherwise Specified, All Voltages Referenced to GND  
Input Rise and Fall Slew Rate, dt/dv  
T = Full Package Temperature Range  
CD54AC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V  
CD54ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
at 1.5V to 3V (AC Types) . . . . . . . . . . . . . . . . . . . 0ns/V to 50ns/V  
at 3.6V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 20ns/V  
at 4.5V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 10ns/V  
A
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . . 0V to V  
CC  
I
O
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper I.C. Handling Procedures.  
File Number 3904  
Copyright © Harris Corporation 1994  
1

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