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CD-MBL1XXSL PDF预览

CD-MBL1XXSL

更新时间: 2024-11-25 01:20:03
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 313K
描述
Surface Mount Bridge Rectifier Diode

CD-MBL1XXSL 数据手册

 浏览型号CD-MBL1XXSL的Datasheet PDF文件第2页浏览型号CD-MBL1XXSL的Datasheet PDF文件第3页浏览型号CD-MBL1XXSL的Datasheet PDF文件第4页 
Features  
Applications  
nꢀ RoHSꢀcompliant*  
nꢀ ACꢀoperatedꢀproducts  
nꢀ Computerꢀmonitors  
nꢀ Set-topꢀboxes  
nꢀ Lowꢀpowerꢀlossꢀandꢀhighꢀefficiency  
nꢀꢀHighꢀcurrentꢀcapability  
nꢀ Lowꢀprofileꢀpackage  
nꢀꢀCableꢀmodems  
ꢀꢀCD-MBL1xxSLꢀSurfaceꢀMountꢀBridgeꢀRectifierꢀDiode  
General Information  
The markets of portable communications, computing and video equipment are  
challenging the semiconductor industry to develop increasingly smaller electronic  
components.  
4
1
+
Bourns offers Bridge Rectifier Diodes for rectification applications in compact chip package  
0.23 ˝ x 0.20 ˝ size format, which offers PCB real estate savings and are considerably smaller  
than standard parts. The Bridge Rectifier Diodes offer a forward current of 1 A with a choice  
of repetitive peak reverse voltages between 600 V and 1000 V.  
~
3
~
2
Absolute Maximum Ratings (@ T = 25 °C Unless Otherwise Noted)  
A
CD-  
Parameter  
Symbol  
Unit  
MBL106SL  
MBL108SL  
MBL110SL  
Maximum Repetitive  
Peak Reverse Voltage  
V
600  
800  
1.0  
45  
1000  
V
A
A
RRM  
Maximum Average Forward Rectified Current (T = 55 °C)  
I
F(AV)  
A
Peak Forward Surge Current 8.3 ms Single Half Sine-Wave  
Superimposed on Rated Load (JEDEC Method)  
I
FSM  
Operating Temperature Range  
Storage Temperature Range  
T
-55 to +175  
-55 to +175  
°C  
°C  
J
T
STG  
Electrical Characteristics (@ T = 25 °C Unless Otherwise Noted)  
A
CD-MBL1xxSL  
Min.  
Parameter  
Symbol  
Unit  
Test Conditions  
Typ.  
Max.  
0.95  
5.0  
Instantaneous Forward Voltage  
Repetitive Peak Reverse Current  
Junction Capacitance  
V
I
= 1 A  
0.92  
V
F
F
V
I
= V  
T = +25 °C  
A
µA  
RRM  
R
RRM  
C
V
= 4 V, f = 1.0 MHz  
R
25  
95  
20  
pF  
J
(1)  
Thermal Resistance, Junction to Air  
R
°C / W  
°C / W  
ΘJA  
(1)  
Thermal Resistance, Junction to Lead  
R
ΘJL  
NOTE 1: Measured when mounted on PCB with 5.0 mm x 5.0 mm (0.2 “ x 0.2 “) copper pad areas.  
*RoHSꢀDirectiveꢀ2002/95/ECꢀJan.ꢀ27,ꢀ2003ꢀincludingꢀannexꢀandꢀRoHSꢀRecastꢀ2011/65/EUꢀJuneꢀ8,ꢀ2011.ꢀ  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.  

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