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CBTD3861DK,118 PDF预览

CBTD3861DK,118

更新时间: 2024-11-16 14:48:23
品牌 Logo 应用领域
恩智浦 - NXP 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
16页 723K
描述
CBTD3861 - 10-bit level shifting bus switch with output enable SSOP2 24-Pin

CBTD3861DK,118 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SSOP2
包装说明:3.90 MM, 0.635 MM PITCH, PLASTIC, MO-137, SOT556-1, SSOP-24针数:24
Reach Compliance Code:compliant风险等级:5.77
Base Number Matches:1

CBTD3861DK,118 数据手册

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CBTD3861  
10-bit level shifting bus switch with output enable  
Rev. 2 — 21 November 2011  
Product data sheet  
1. General description  
The CBTD3861 provides ten bits of high-speed TTL-compatible bus switching. The low  
ON resistance of the switch allows connections to be made with minimal propagation  
delay.  
The CBTD3861 device is organized as one 10-bit bus switches with one output enable  
(OE) input. When OE is LOW, the switch is on and port A is connected to the B port. When  
OE is HIGH, each switch is disabled.  
The CBTD3861 is characterized for operation from 40 C to +85 C.  
2. Features and benefits  
Designed to be used in 5 V to 3.3 V level shifting applications with internal diode  
5 switch connection between two ports  
TTL-compatible control input levels  
Multiple package options  
Latch-up protection exceeds 100 mA per JESD78  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
CDM JESD22-C101C exceeds 1000 V  
3. Ordering information  
Table 1.  
Type number Package  
Temperature  
Ordering information  
Name  
Description  
Version  
range  
CBTD3861PW 40 C to +85 C  
TSSOP24  
plastic thin shrink small outline package; 24 leads;  
body width 4.4 mm  
SOT355-1  
SOT556-1  
CBTD3861DK 40 C to +85 C  
CBTD3861BQ 40 C to +85 C  
SSOP24[1] plastic shrink small outline package; 24 leads;  
body width 3.9 mm; lead pitch 0.635 mm  
DHVQFN24 plastic dual in-line compatible thermal enhanced very thin SOT815-1  
quad flat package; no leads; 24 terminals;  
body 3.5 5.5 0.85 mm  
[1] Also known as QSOP24 package  
 
 
 
 

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