MULTILAYER CHIP FERRITE BEADS
CBM453215U190T
CBM453215U260T
CBM453215U280T
CBM453215U300T
CBM453215U310T
CBM453215U380T
CBM453215U400T
CBM453215U500T
CBM453215U600T
CBM453215U700T
CBM453215U101T
CBM453215U181T
CBM453215U221T
CBM453215U501T
CBM453215U601T
12~25Ω
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
19
26
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.02
0.02
0.08
0.08
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
4000
4000
28
30
31
38
40
50
60
70
100
180
220
500
600
◆可靠性测试方法
Reliability Test Method
序号
项目
要求
试验方法及备注
No.
Items
Requirements
Test Methods and Remarks
工作温度范围
Operating
包含产品表面温升
1
-55℃~+125℃
Includes product surface temperature rise
Temperature Range
预热温度:120℃ ~ 150℃
预热时间: 60s
焊料:(96.5%Sn/3.0%Ag/0.5%Cu)焊锡
焊锡温度: 245℃±5℃
浸锡深度:10mm
无可见损伤;
电极面 95%以上覆盖新的焊料。
浸锡时间 : 5±1s
可焊性
浸绩到助焊剂约:3 ~ 5 s
2
Solder ability
95% or more of electrode area shall be Preheating temperature:120℃ to 150℃
coated by new solder.
Preheating time: 60s
Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder.
Solder temperature: 245±5℃
Immersion tin depth:10mm
Duration : 5±1s
Dip performance to a flux of about:3 ~ 5 s
6