MULTILAVER CHIP FERRITE BEADS
频率10Hz~2000Hz;
加速度5克;
一个循环20分钟;
无可见损伤;
X、Y、Z三个方向每个方向12个循环,共36个循环;.
The entire frequency range of 10 to 2000 Hz and return to
10 Hz shall be traversed in 20 minutes. This cycle shall be
振动
阻抗:△Z/Z ≤ ±30%。
No Visible damage;
6
Vibration
Impedance:△ Z/Z within ±30% preformed 12 time in each of three mutually perpendicular
directions (total of 36 times), so that the motion shall be
applied for a total period of approximately 12 hours. Peak
value 5g.
焊槽法;
无可见损伤;
温度(260±5) ℃;
耐焊接热
阻抗:△Z/Z ≤ ±30%。
No Visible damage;
Impedance:△Z/Z ≤ ±30%
浸渍时间(10±1) s。
Solder bath;
7
Resistance
to
Soldering Heat
Temperature (260±5) ℃;
Immersion timer (10±1) seconds.
焊槽法;无铅焊锡;
温度(245±5) ℃;
浸渍时间(3±0.3) s。
无可见损伤;
可焊性
电极面95%以上覆盖新的焊料。
8
Solder ability
95% or more of electrode area Solder bath; Lead-free solder;
shall be coated by new solder.
Temperature (245±5) ℃;
Immersion timer (3±0.3) seconds.
电感器安装在厚1.6mm环氧玻璃布板上,以1mm/s的速度向
下弯曲2mm;
无可见损伤;
维持时间60s±5s。
弯曲
阻抗:△Z/Z≤±30%。
No Visible damage;
Impedance:△Z/Z ≤ ±30%
9
The testing samples shall be mounted on a 100mm×40mm
FR4 PCB board,which is 1.6mm±0.2mm thick。
Bending shall be applied to the 2.0mm with 1.0mm/sec;
Duration:60±5s。
Board flex
试样安装在环氧玻璃布板上,施加1005规格:5N,≥1608规
格:17.7N的力到试样的侧面,保持60s±1s。
The testing samples shall be mounted on the testing epoxy
boards,exerting force on side of the samples, Size 1005:
5N ; ≥ Size 1608:17.7N,
Duration 60s±1s。
无可见损伤;
端子强度
阻抗:△Z/Z ≤±30%。
No Visible damage;
Impedance:△Z/Z ≤ ±30%
10
Terminal Strength
(SMD)
◆产品特性曲线图
Product Characteristic Curve
CBF1005 Type
4