MULTILAVER CHIP FERRITE BEADS
■叠层片式铁氧体高频磁珠
Multilayer Chip Ferrite High Frequency Beads
◆特征
Feature
* 体积小
Miniature volume.
* 漏磁小,不产生耦合,可靠性高
No cross coupling between inductors due to low magnetic shield and high reliability.
* 无引线,不产生跟踪性,适合高密度表面贴装
No lead,ideal for high density SMT installation,with no directionality.
* 优良的可焊性及耐热冲击性,适合回流焊
Superior solderability and resistance to soldering heat,suitable for reflow soldering.
* 在GHz频带下对EMI的抑制有完美效果
Perfect EMI suppression in the GHz band
◆应用
Application
* 除去智能手机以及平板终端等移动设备及各类组件的高频噪音
Removal of high frequency noise from end mobile devices such as smartphones and various components.
* 除去PC、DVD、 STB等家电、智能电网以及产业机器的高频噪音
Removal of high frequency noise from appliances such as PCs, DVDs, STBs, smart grids and industrial machinery.
◆型号表示法
Part Number
CBF
100505
B
182
T
产品代号
规格尺寸(L×W×T)
材料代号
阻抗(Ω)
Product Code
Dimensions (mm)
Material Code
Impedance
叠层片式铁氧体高频磁珠
Multilayer Chip Ferrite High
Frequency Beads
060303
100505
160808
0.6×0.3×0.3
1.0×0.5×0.5
1.6×0.8×0.8
B
D
示例 Exampie
T
B
卷带盘装
Tape & Reel
散装
181
102
182
180
CBF
1000
1800
Bulk
◆产品结构Product Structure
a.银层 Ag layer
b.镀层Ni/Sn plating
c.内电极Inner electrode
1