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C5750X7R2E105KT

更新时间： 2024-11-24 21:20:47
品牌 Logo 应用领域
东电化 - TDK 电容器
页数 文件大小 规格书
1页 786K
描述
Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS AND REACH COMPLIANT

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中文翻译

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C5750X7R2E105KT 数据手册

  
Soft Termination C Series  
Case  
Length (mm)  
Width (mm)  
MaxThickness (mm)  
C2012 (0805)  
C3216 (1206)  
C3225 (1210)  
C4532 (1812)  
C5750 (2220)  
2.00 ± 0.20  
3.20 ± 0.20  
3.20 ± 0.20  
4.50 ± 0.40  
5.70 ± 0.40  
1.25 ± 0.20  
1.60 ± 0.20  
2.50 ± 0.30  
3.20 ± 0.40  
5.70 ± 0.40  
1.45  
1.80  
2.80  
2.50  
3.10  
L
W
T
C
2012 X8R 1H 683 K T XXXS  
Series Name  
Dimensions L x W (mm)  
Temperature Characteristic  
Rated Voltage (DC)  
Nominal Capacitance (pF)  
• Improved bending resistance (Board Flex Resistance)  
• Improved temperature cycle performance  
• Soft termination is available for most TDK MLCC product lines (up to C3225  
case size) and including the 2-in-1 Cap Array line  
• RoHS, WEE, and REACH compliant  
Capacitance Tolerance  
Packaging Style  
• Automotive powertrain control unit / sensor module  
• Switching power supply  
Internal Codes  
• Telecom base station  
• Electronic circuits mounted on alumina substrate  
• SMT application which requires bending robustness  
• Pb-free solder application in which solder joint reliability is problematic  
C2012 (0805)  
C3216 (1206)  
C3225 (1210)  
C4532 (1812)  
C5750 (2220)  
Capacitance  
450V  
(2W)  
250V  
(2E)  
100V  
(2A)  
50V  
(1H)  
35V  
(1V)  
16V  
(1C)  
630V  
450V  
250V  
100V  
(2A)  
50V  
35V  
(1V)  
25V  
(1E)  
630V  
(2J)  
450V  
(2W)  
250V  
(2E)  
100V  
50V  
(1H)  
630V  
(2J)  
450V  
(2W)  
250V  
630V  
(2J)  
450V  
(2W)  
250V  
(2E)  
100V  
(2A)  
(2J)  
X7R  
X7R  
X7T  
(2W)  
(2E)  
(1H)  
(2A)  
(2E)  
10 nF  
22 nF  
47 nF  
100 nF  
220nF  
470nF  
1,0 uF  
2,2 uF  
4,7 uF  
10 uF  
X7T  
X7T  
X7T  
X7R  
X7R  
X7T  
X7T  
X7R  
X7T  
X7T  
X7R  
X7T  
X7R  
X7R  
X7S  
X7S  
X7S  
X7T  
X7T  
X7R  
X7R  
X7R  
X7R  
X7S  
X7T  
X7R  
X7T  
X7T  
X7R  
X7R  
X7T  
X7R  
X7T  
X7R  
X7R  
X7S  
X7R  
X7R  
X7S  
X7S  
X7R  
X7S  
MLCC Construction  
• Excessive board bending during PCB manufacturing or final assembling is common, and the brittle nature  
Material  
No.  
1
Name  
Cross Section  
of ceramic components is especially prone to damage after being soldered to the PCB. TDK has expanded  
line of board flex solutions by introducing soft termination capacitor with a conductive resin terminal layer  
that protects the ceramic body by absorbing external stress. Soft term caps are also good protection from  
brittle solder fillets when using Pb-free solder.  
Standard Term  
Soft Term  
Dielectric  
BaTiO  
Ni  
3
BaTiO3  
3
Inner  
Electrode  
2
Ni  
4
3
5
3
Cu  
Cu  
6
Board Flex Data  
(Bending Test: C3216X7R1C106K)  
Temperature Cycle Test Data  
(Liquid Phase) -55 to 125degC / Sn-3.0Ag-0.5Cu  
Conductive  
Resin  
4
----  
Terminal  
Electrode  
>10  
5
Ni  
Sn  
10.0  
9.0  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1
2
6
Cross Sectional Analysis  
Standard Term  
Soft Term  
Solder Crack  
Standard Term  
Soft Term  
Min Bending Limit  
Soft Term  
Standard Term  
• Bending test result shows high performance.  
• Soft Termination offers superior performance to  
standard termination in temperature cycle test.  
Crack  
Rev. Oct. 2010  
1

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