Datasheet > C5750X7R1H685M250KA_17

C5750X7R1H685M250KA_17

更新时间： 2024-11-28 01:13:11

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	234K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : June 07, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C5750X7R1H685M250KA

TDK item description C5750X7R1H685MT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C5750 [EIA 2220]

Production (Not Recommended for New Design)

Size

Length(L)

5.70mm ±0.40mm

Width(W)

5.00mm ±0.40mm

2.50mm ±0.30mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

4.10mm to 4.80mm

1.20mm to 1.40mm

4.00mm to 5.00mm

Electrical Characteristics

Capacitance

6.8μF ±20%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

73MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

500pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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