Datasheet > C3216X7T2J223M115AC_17

C3216X7T2J223M115AC_17

更新时间： 2024-09-22 01:13:03

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东电化 - TDK		/
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3页	238K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : March 08, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3216X7R2E153K115AA

TDK item description C3216X7R2E153KT****

Commercial Grade

Applications

Please refer to Part No. CGA5H3X7R2E153K115AA for Automotive use.

Mid Mid Voltage (100 to 630V)

C3216 [EIA 1206]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

3.20mm ±0.20mm

Length(L)

Width(W)

1.60mm ±0.20mm

1.15mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

1.00mm Min.

2.10mm to 2.50mm(Flow Soldering)

2.00mm to 2.40mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.10mm to 1.30mm(Flow Soldering)

1.00mm to 1.20mm(Reﬂow Soldering)

1.00mm to 1.30mm(Flow Soldering)

1.10mm to 1.60mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

15nF ±10%

250VDC

X7R(±15%)

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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