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C3216X7S2A225MT

更新时间: 2024-11-21 06:45:55
品牌 Logo 应用领域
东电化 - TDK 电容器
页数 文件大小 规格书
1页 101K
描述
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

C3216X7S2A225MT 数据手册

  
SPECIFICATION FOR  
TDK MULTILAYER CERAMIC CHIP CAPACITORS  
Date issue :Jul. 2. '09  
TDK P/N  
C3216 X7S 2A 225 M T XXXX  
5)  
1)  
2)  
3)  
4)  
6)  
7)  
No.  
1 Case Size  
Segment  
Detail  
Comments  
3.20 x 1.60 mm  
See below for dimensions.  
Class II : Conforms to EIA 198  
DC  
2 Temperature Characteristics  
3 Rated Voltage  
-55 to +125degC +/-22%  
100V  
4 Capacitance  
2,200,000pF  
M : +/-20%  
1.0+/-0.2Vrms, 1kHz+/-10%  
Conforms to IEC 384-9  
EIA 481 Format  
5 Capacitance Tolerance  
6 Packaging Style  
Tape and Reel, 8mm  
XXXX  
7 TDK internal Code  
- Dissipation Factor  
- Insulation Resistance  
(Internal TDK use only)  
1.0+/-0.2Vrms, 1kHz+/-10%  
apply rated voltage for 60s  
0.05 Max.  
227Mohm min.  
Condition for life : Apply 1.5 x rated voltage at maximum operating temperature +/-2degC for 1,000+48, 0h.  
Physical Dimensions  
Material System  
3
4
5
L
W
G
B
T
2
1
Symbol  
Dimensions(mm)  
3.20 +/- 0.20  
1.60 +/- 0.20  
1.60 +/- 0.20  
0.20 min.  
No.  
1
Name  
Material  
L
W
T
B
G
Dielectric  
Electrode  
BaTiO3  
Ni  
2
3
Cu  
4
Termination  
Ni  
1.00 min.  
5
Sn  
1
This datasheet is to be used for reference purposes only and is subject to change by TDK without notice.  
It reflects an overview of the product characteristics/performance for the particular part number. For product specification information,  
please refer to TDK's general product specification. Please note that this standard part is not designed or warranted to meet any  
specifications of any intermediate or end user different from or in addition to the specifications set forth in TDK's general product  
specification. Note also that this standard part has not been specially designed or manufactured for, nor is it intended or warranted  
for use in, or permitted to be resold for, specialized applications such as aviation, medical, and/or governmental/military applications  
(collectively, “Excluded Applications").  
is a trademark or registered trademark of TDK Corporation.  

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