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Creation Date : May 19, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012X7R1C155K125AB
TDK item description C2012X7R1C155KT****
Commercial Grade
Applications
Please refer to Part No. CGA4J3X7R1C155K125AB for Automotive use.
General General (Up to 50V)
C2012 [EIA 0805]
Production (Not Recommended for New Design)
Feature
Series
Status
Size
2.00mm ±0.20mm
Length(L)
Width(W)
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
1.5μF ±10%
16VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X7R(±15%)
7.5%
66MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
2000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.