Datasheet > C2012JB1C225M085AC_17

C2012JB1C225M085AC_17

更新时间： 2024-11-25 01:17:03

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	233K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X5R1V155K125AB

TDK item description C2012X5R1V155KT****

Commercial Grade

Applications

Please refer to Part No. CGA4J3X5R1V155K125AB for Automotive use.

General General (Up to 50V)

Feature

Series

Status

C2012 [EIA 0805]

Production

Size

2.00mm ±0.20mm

Length(L)

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

1.5μF ±10%

35VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

333MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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