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C1812C300KFGACTU PDF预览

C1812C300KFGACTU

更新时间: 2024-11-25 12:59:11
品牌 Logo 应用领域
基美 - KEMET 高压
页数 文件大小 规格书
9页 1651K
描述
Ceramic Capacitor, Multilayer, Ceramic, 1500V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00003uF, Surface Mount, 1812, CHIP

C1812C300KFGACTU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 1812
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.00.20风险等级:5.52
电容:0.00003 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC高度:1 mm
JESD-609代码:e3长度:4.5 mm
安装特点:SURFACE MOUNT多层:Yes
负容差:10%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE封装形式:SMT
包装方法:TR, Embossed Plastic, 7 Inch正容差:10%
额定(直流)电压(URdc):1500 V尺寸代码:1812
表面贴装:YES温度特性代码:C0G
温度系数:30ppm/Cel ppm/ °C端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状:WRAPAROUND宽度:3.2 mm
Base Number Matches:1

C1812C300KFGACTU 数据手册

 浏览型号C1812C300KFGACTU的Datasheet PDF文件第2页浏览型号C1812C300KFGACTU的Datasheet PDF文件第3页浏览型号C1812C300KFGACTU的Datasheet PDF文件第4页浏览型号C1812C300KFGACTU的Datasheet PDF文件第5页浏览型号C1812C300KFGACTU的Datasheet PDF文件第6页浏览型号C1812C300KFGACTU的Datasheet PDF文件第7页 
CERAMIC CHIP / HIGH VOLTAGE  
KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They  
offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin  
(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering  
applications. An insulating coating may be required to prevent surface arcing. These components are RoHS  
compliant.  
MARKETS  
APPLICATIONS  
Switch Mode Power Supply Power Supply  
Input Filter  
High Voltage Power Supply  
Resonators  
DC-DC Converter  
Tank Circuit  
Snubber Circuit  
LCD Fluorescent Backlight Ballast  
HID Lighting  
Output Filter  
Telecommunications Equipment  
Industrial Equipment/Control  
Medical Equipment/Control  
Computer (LAN/WAN Interface)  
Analog and Digital Modems  
Automotive  
High Voltage Coupling  
High Voltage DC Blocking  
Lighting Ballast  
Voltage Multiplier Circuits  
Coupling Capacitor/CUK  
OUTLINE DRAWING  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
TABLE 1 - DIMENSIONS - MILLIMETERS (in.)  
Metric  
Code  
EIA Size  
Code  
Band  
Separation  
L - Length  
W - Width  
B - Bandwidth  
2.0 (0.079)  
0.2 (0.008)  
1.2 (0.049)  
0.2 (0.008)  
0.5 (0.02  
0.25 (0.010)  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
0.75 (0.030)  
N/A  
3.2 (0.126)  
0.2 (0.008)  
1.6 (0.063)  
0.2 (0.008)  
0.5 (0.02)  
0.25 (0.010)  
3.2 (0.126)  
0.2 (0.008)  
2.5 (0.098)  
0.2 (0.008)  
0.5 (0.02)  
0.25 (0.010)  
N/A  
4.5 (0.177)  
0.3 (0.012)  
2.0 (0.079  
0.2 (0.008)  
0.6 (0.024)  
0.35 (0.014)  
N/A  
4.5 (0.177)  
0.3 (0.012)  
3.2 (0.126)  
0.3 (0.012)  
0.6 (0.024)  
0.35 (0.014)  
N/A  
4.5 (0.177)  
0.3 (0.012)  
6.4 (0.250)  
0.4 (0.016)  
0.6 (0.024)  
0.35 (0.014)  
N/A  
5.6 (0.224)  
0.4 (0.016)  
5.0 (0.197)  
0.4 (0.016)  
0.6 (0.024)  
0.35 (0.014)  
N/A  
5.6 (0.224)  
0.4 (0.016)  
6.4 (0.250)  
0.4 (0.016)  
0.6 (0.024)  
0.35 (0.014)  
N/A  
81  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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