Datasheet > C1608X8R1E154M080AE

C1608X8R1E154M080AE

更新时间： 2024-11-25 01:24:15

品牌	Logo	应用领域
东电化 - TDK		电容器
页数	文件大小	规格书
3页	122K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : November 29, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C1608X8R1E154M080AE

TDK item description C1608X8R1E154MT***S

Commercial Grade

Applications

Please refer to Part No. CGA3E3X8R1E154M080AE for Automotive use.

150°C High Temperature Application

Soft Soft Termination

Feature

Series

Status

C1608 [EIA 0603]

Production

Size

1.60mm +0.20,-0.10mm

Length(L)

Width(W)

0.80mm +0.15,-0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

150nF ±20%

25VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X8R(±15%)

3333MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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