Datasheet > C1206X271J3RAC

C1206X271J3RAC

更新时间： 2024-11-23 04:51:07

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
4页	114K
描述
Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

C1206X271J3RAC 数据手册

Product Bulletin

Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations

Outline Drawing

Tin Plate

Electrodes

Nickel Plate

Silver Epoxy

Conductive Metallization

The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a unique and flexible termi-

nation system. Integrated with KEMET's standard termination materials, a conductive epoxy is utilized

between the conductive metallization and nickel barrier finish in order to establish pliability while maintain-

ing terminal strength, solderability and electrical performance. This technology directs board flex stress away

from the ceramic body and into the termination area. As a result, this termination system mitigates the risk

of low-IR or short-circuit failures associated with board flex. The FT-CAP complements our current "Open

Mode" and "Flexible Electrode (FE-CAP)" products by providing our customers with a complete portfolio of

flex solutions.

Dimensions – Millimeters (Inches)

EIA Size Metric Size

Code

0603

0805

1206

1210

Code

1608

2012

3216

3225

Length

Width

Bandwidth

Separation

1.6 (.063) ± 0.15 (.006) 0.8 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)

2.0 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.05 (.02) ± 0.25 (.010) 0.75 (.030)

3.2 (.126) ± 0.20 (.008) 1.6 (.063) ± 0.20 (.008)

3.2 (.126) ± 0.20 (.008) 2.5 (.098) ± 0.20 (.008)

0.50 (.02) ± .25 (.010)

N/A

See Capacitance Value Table next page for thickness dimension.

Ordering Information

0603

224

Style

C - Ceramic

Size Code

See dimension table

End Metallization

C = Standard (Tin-plate)

Specification

X - Flexible Termination

Failure Rate Level

A = Not Applicable

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

R – X7R (±15%) (-55°C +125°C)

Capacitance Tolerance

K = ±10%; M = ±20%; J = ±5%

Voltage

9 = 6.3V, 8 = 10V, 4 = 16V, 3 = 25V,

5 = 50V, 1 = 100V, 2 = 200V

F3281 5/07

12 3 4

中文翻译

下载PDF

与C1206X271J3RAC相关器件

型号	品牌	获取价格	描述	数据表
C1206X271J4RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271J5RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271J8RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271J9RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K1RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K2RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K3RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K4RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K5RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
C1206X271K8RAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations

与C1206X271J3RAC相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

35
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

27
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

55
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

52

产品中心

服务支持

精选活动

关于我们

帮助中心

C1206X271J3RAC

C1206X271J3RAC 数据手册

与C1206X271J3RAC相关器件

与C1206X271J3RAC相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

C1206X271J3RAC

C1206X271J3RAC 数据手册

与C1206X271J3RAC相关器件

与C1206X271J3RAC相关文章

您还可以找

您在本页遇到什么问题？