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C1206C223K3GAC PDF预览

C1206C223K3GAC

更新时间： 2024-12-01 05:16:47
品牌 Logo 应用领域
基美 - KEMET 电容器固定电容器
页数 文件大小 规格书
2页 51K
描述
Surface Mount Ceramic Chip Capacitors - C0G Dielectric

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C1206C223K3GAC 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 1206
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.54
Is Samacsys：N电容：0.022 µF
电容器类型：CERAMIC CAPACITOR介电材料：CERAMIC
高度：0.78 mmJESD-609代码：e3
长度：3.2 mm安装特点：SURFACE MOUNT
多层：Yes负容差：10%
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：SMT包装方法：TR, EMBOSSED PLASTIC/PAPER, 7/13 INCH
正容差：10%额定（直流）电压（URdc）：25 V
尺寸代码：1206表面贴装：YES
温度特性代码：C0G温度系数：30ppm/Cel ppm/ °C
端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier端子形状：WRAPAROUND
宽度：1.6 mmBase Number Matches：1

C1206C223K3GAC 数据手册

 浏览型号C1206C223K3GAC的Datasheet PDF文件第2页 
Product Bulletin  
Surface Mount Ceramic Chip Capacitors – C0G Dielectric  
Outline Drawing  
L
TIN PLATE  
W
T
B
NICKEL PLATE  
S
ELECTRODES  
CONDUCTIVE METALLIZATION  
Dimensions - Millimeters (Inches)  
S
EIA SIZE  
CODE  
METRIC  
SIZE CODE  
MOUNTING  
TECHNIQUE  
L - LENGTH  
W - WIDTH  
B - BANDWIDTH  
SEPARATION  
minimum  
0402  
0603  
0805  
1206  
1210  
1005  
1608  
2012  
3216  
3225  
1.0 (.04) ± .05 (.002)  
1.6 (.063) ± .15 (.006)  
2.0 (.079) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
0.5 (.02) ± .05 (.002)  
0.8 (.032) ± .15 (.006)  
1.25 (.049) ± .20 (.008)  
1.6 (.063) ± .20 (.008)  
2.5 (.098) ± .20 (.008)  
0.20 (.008) -.40 (.016)  
0.35 (.014) ± .15 (.006)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.3 (.012)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Reflow  
Solder Wave +  
or  
Solder Reflow  
N/A  
See Capacitance Value Chart below for thickness dimension.  
+ For extended values 1210 case sizes - solder reflow only.  
Electrical Parameters  
As detailed in the KEMET Surface Mount Catalog F3102 for C0G, with following specific requirements based on room  
temperature (25°C) parameters:  
•
•
Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 30 PPM/°C over that range.  
Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1000 megohm microfarads or  
100GΩ, whichever is less.  
•
Capacitance and Dissipation Factor (DF) measured at the following conditions.  
Capacitance - 1 kHz and 1 vrms if capacitance >1000 pF  
1 MHz and 1 vrms if capacitance ≤ 1000 pF  
DF Limit is 0.1%.  
Soldering Process  
These components are suitable for wave and reflow soldering. All parts incorporate the standard KEMET  
barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-  
ance to leaching.  
Marking  
These chips will be supplied unmarked. However, marking is available as an extra cost option.  
Qualification/Certification  
AEC-Q200 Rev. C - Automotive  
RoHS 6 - 100% tin termination  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
F9126 5/07  
12

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