Datasheet > C1005X8R1E333K050BC_17

C1005X8R1E333K050BC_17

更新时间： 2024-11-25 01:26:07

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	122K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : July 06, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C1005X8R1E333K050BC

TDK item description C1005X8R1E333KT****

Commercial Grade

Applications

Please refer to Part No. CGA2B1X8R1E333K050BC for Automotive use.

Feature

Series

Status

150°C High Temperature Application

C1005 [EIA 0402]

Production (Not Recommended for New Design)

Size

Length(L)

1.00mm ±0.05mm

Width(W)

0.50mm ±0.05mm

0.10mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.30mm Min.

0.30mm to 0.50mm

0.35mm to 0.45mm

0.40mm to 0.60mm

Electrical Characteristics

Capacitance

33nF ±10%

25VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X8R(±15%)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Punched (Paper)Taping [180mm Reel]

10000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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