Datasheet > C1005X5R1H331K050BA_17

C1005X5R1H331K050BA_17

更新时间： 2024-01-31 04:58:43

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	235K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : April 12, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C1005X5R1H331K050BA

TDK item description C1005X5R1H331KT****

Commercial Grade

Applications

Please refer to Part No. CGA2B2X5R1H331K050BA for Automotive use.

General General (Up to 50V)

C1005 [EIA 0402]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

1.00mm ±0.05mm

Length(L)

Width(W)

0.50mm ±0.05mm

0.10mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.30mm Min.

0.30mm to 0.50mm

0.35mm to 0.45mm

0.40mm to 0.60mm

Electrical Characteristics

Capacitance

330pF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Punched (Paper)Taping [180mm Reel]

10000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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