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C1004

更新时间: 2024-11-23 22:28:07
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描述
Process C1004

C1004 数据手册

 浏览型号C1004的Datasheet PDF文件第2页 
®
ISO 9001 Registered  
Process C1004  
CMOS 1.0µm  
5 Volt Digital  
Electrical Characteristics  
T=25oC Unless otherwise noted  
N-Channel Transistor  
Threshold Voltage  
Body Factor  
Conduction Factor  
Effective Channel Length  
Width Encroachment  
Punch Through Voltage  
Poly Field Threshold  
Symbol  
VTN  
γN  
Minimum  
Typical  
0.75  
0.60  
87  
0.75  
0.8  
Maximum  
Unit  
V
Comments  
100x1.0µm  
100x1.0µm  
0.55  
0.95  
V1/2  
βN  
LeffN  
WN  
74  
0.60  
100  
0.90  
µA/V2 100x100µm  
µm  
µm  
V
100x1.0µm  
Per side  
BVDSSN  
7
10  
VTFP(N  
)
V
P-Channel Transistor  
Threshold Voltage  
Body Factor  
Symbol  
VTP  
γP  
Minimum  
–0.85  
Typical  
–1.0  
0.4  
Maximum  
Unit  
V
Comments  
100x1.0µm  
100x1.0µm  
–1.15  
V1/2  
Conduction Factor  
βP  
24  
28  
32  
µA/V2 100x100µm  
Effective Channel Length  
Width Encroachment  
Punch Through Voltage  
Poly Field Threshold Voltage  
LeffP  
WP  
BVDSSP  
VTFP(P)  
0.83  
0.98  
0.85  
1.13  
µm  
µm  
V
100x1.0µm  
Per side  
–7  
–10  
V
Diffusion & Thin Films  
Well (field) Sheet Resistance  
N+ Sheet Resistance  
N+ Junction Depth  
P+ Sheet Resistance  
P+ Junction Depth  
Gate Oxide Thickness  
Field Oxide Thickness  
Poly Sheet Resistance  
Metal-1 Sheet Resistance  
Metal-2 Sheet Resistance  
Passivation Thickness  
Symbol  
Minimum  
0.8  
Typical  
1.0  
35  
0.45  
80  
0.5  
20  
700  
22  
50  
Maximum  
1.22  
Unit  
K/o n-well  
/o  
µm  
/o  
µm  
nm  
nm  
/o  
Comments  
ρN-well(f)  
ρN+  
20  
50  
xjN+  
ρP+  
60  
15  
100  
30  
xjP+  
TGOX  
TFIELD  
ρPOLY  
ρM1  
ρM2  
m/o  
m/o  
nm  
30  
200+900  
TPASS  
oxide+nit.  
Capacitance  
Gate Oxide  
Metal-1 to Poly1  
Metal-1 to SIlicon  
Metal-2 to Metal-1  
Symbol  
Cox  
CM1P  
CMIS  
Minimum  
Typical  
1.64  
0.046  
0.028  
0.038  
Maximum  
Unit  
Comments  
1.52  
1.82  
fF/µm2  
fF/µm2  
fF/µm2  
fF/µm2  
CMM  
© IMP, Inc.  
17  

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