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C0816X5R6.3474KT

更新时间： 2024-12-02 09:38:55
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
1页 1813K
描述
CAPACITOR, CERAMIC

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C0816X5R6.3474KT 数据手册

  
Version A11  
For decoupling capacitors, the parasitic  
inductance generated by the capacitor needs to be  
small so that the resonant frequency is higher. The  
parasitic inductance will add noise voltage spikes to  
the power line voltage as shown in the following  
equation:  
Internal structure of the standard MLCC  
TDK Flip Type capacitor offers industry standard  
case sizes in “flip” geometry construction which allows lower  
ESL than standard capacitors. By rotating the orientation of the  
capacitor 90º, the current path through the unit is shorten and  
effectively lowers the parasitic inductance value. The flip  
Internal structure of the Flip Type MLCC  
geometry requires the termination to be applied along the  
length instead of the width of the MLCC. Flip Type series are  
available in four case sizes with voltage from 4V to 16V.  
Reduced ESL is necessary for noise decoupling in high speed applications;  
these Flip Type capacitors are typically placed around ASICs as well as on the CPU  
power line for decoupling purposes.  
δi/δt can be very large when operating under very high frequency, where L is the  
parasitic inductance. In order to stabilize the power line without adding anymore noise  
from the capacitor, parasitic inductance needs to be small. Because of the unique  
design of the Flip Type capacitor, the parasitic inductance is lower than the traditional  
multilayer ceramic capacitor (MLCC). Therefore, the Flip Type MLCC is very effective  
for high speed decoupling applications.  
Chip  
capacitor  
Solder  
land  
3
4
5
Solder  
resist  
Series  
Voltage  
103 223 473 104 224 474 105 225 475 106  
4V  
4V  
C0510 (0204)  
C
6.3V  
10V  
16V  
6.3V  
10V  
16V  
25V  
50V  
4V  
C0816 (0306)  
C1220 (0508)  
2
1
Unit: mm  
B
A
MATERIAL  
Class 2  
No.  
NAME  
(1) Ceramic Dielectric  
(2) Internal Electrode  
(3)  
(4)  
(5)  
BaTiO3  
Nickel (Ni)  
6.3V  
10V  
16V  
25V  
50V  
A
B
C
0.20  
0.20  
1.00  
0.30  
0.35  
1.60  
0.50  
0.55  
2.00  
0.75  
0.725  
3.20  
Copper (Cu)  
Nickel (Ni)  
Tin (Sn)  
C1632 (0612)  
Termination  
C 1632 X7R 1H 224 K T OOOO  
Flipped geometry  
provides low inductance  
(less than 400 pH)  
Decoupling CPU power line  
High speed digital  
IC/decoupling  
B
L
1
2
3
4
5
6
7
8
W
B
Allows adequate high  
frequency current to IC  
Provides stabilization o
power line voltage  
High frequency noise  
suppression  
PC, cell phones, camcorders,  
etc.  
1) Series Name  
2) Dimensions L x W (mm)  
T
3) Temperature Characteristics  
4) Rated Voltage (DC)  
5) Nominal Capacitance (pF)  
6) Capacitance Tolerance  
7) Packaging Style  
C0510 (0204)  
C0812 (0306)  
C1220 (0508)  
C1632 (0612)  
0.52  
1.00  
1.60  
2.00  
3.20  
0.35  
0.60  
1.00  
1.45  
L
W
T
Body Length  
Body Width  
Body Height  
0.80  
1.25  
1.60  
8) Internal Codes  
B
Terminal Width  
TDK Corporation of America  
[web] http://www.tdk.com :: [telephone] (847) 699 - 2299  
Contents are subject to change without notice  
Material prepared by TDK Components, U.S.A. Inc.  
1

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