Datasheet > C0816X5R6.3474KT

C0816X5R6.3474KT

更新时间： 2023-05-15 00:00:00

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
1页	1813K
描述
CAPACITOR, CERAMIC

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C0816X5R6.3474KT 数据手册

Version A11

For decoupling capacitors, the parasitic

inductance generated by the capacitor needs to be

small so that the resonant frequency is higher. The

parasitic inductance will add noise voltage spikes to

the power line voltage as shown in the following

equation:

Internal structure of the standard MLCC

TDK Flip Type capacitor offers industry standard

case sizes in “flip” geometry construction which allows lower

ESL than standard capacitors. By rotating the orientation of the

capacitor 90º, the current path through the unit is shorten and

effectively lowers the parasitic inductance value. The flip

Internal structure of the Flip Type MLCC

geometry requires the termination to be applied along the

length instead of the width of the MLCC. Flip Type series are

available in four case sizes with voltage from 4V to 16V.

Reduced ESL is necessary for noise decoupling in high speed applications;

these Flip Type capacitors are typically placed around ASICs as well as on the CPU

power line for decoupling purposes.

δi/δt can be very large when operating under very high frequency, where L is the

parasitic inductance. In order to stabilize the power line without adding anymore noise

from the capacitor, parasitic inductance needs to be small. Because of the unique

design of the Flip Type capacitor, the parasitic inductance is lower than the traditional

multilayer ceramic capacitor (MLCC). Therefore, the Flip Type MLCC is very effective

for high speed decoupling applications.

Chip

capacitor

Solder

land

Solder

resist

Series

Voltage

103 223 473 104 224 474 105 225 475 106

C0510 (0204)

6.3V

10V

16V

6.3V

10V

16V

25V

50V

C0816 (0306)

C1220 (0508)

Unit: mm

MATERIAL

Class 2

No.

NAME

(1) Ceramic Dielectric

(2) Internal Electrode

(3)

(4)

(5)

BaTiO₃

Nickel (Ni)

6.3V

10V

16V

25V

50V

0.20

1.00

0.30

0.35

1.60

0.50

0.55

2.00

0.75

0.725

3.20

Copper (Cu)

Nickel (Ni)

Tin (Sn)

C1632 (0612)

Termination

C 1632 X7R 1H 224 K T OOOO

 Flipped geometry

provides low inductance

(less than 400 pH)

 Decoupling CPU power line

 High speed digital

IC/decoupling

 Allows adequate high

frequency current to IC

 Provides stabilization of

power line voltage

 High frequency noise

suppression

 PC, cell phones, camcorders,

etc.

1) Series Name

2) Dimensions L x W (mm)

3) Temperature Characteristics

4) Rated Voltage (DC)

5) Nominal Capacitance (pF)

6) Capacitance Tolerance

7) Packaging Style

C0510 (0204)

C0812 (0306)

C1220 (0508)

C1632 (0612)

0.52

1.00

1.60

2.00

3.20

0.35

0.60

1.00

1.45

Body Length

Body Width

Body Height

0.80

1.25

1.60

8) Internal Codes

Terminal Width

TDK Corporation of America

[web] http://www.tdk.com :: [telephone] (847) 699 - 2299

Contents are subject to change without notice

Material prepared by TDK Components, U.S.A. Inc.

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