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C0805Y103K1RAC7800 PDF预览

C0805Y103K1RAC7800

更新时间: 2024-11-14 14:50:11
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
4页 131K
描述
Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

C0805Y103K1RAC7800 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:, 0805
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.0020风险等级:5.74
Is Samacsys:N电容:0.01 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
JESD-609代码:e3安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
包装方法:TR, PLASTIC, 7 INCH正容差:10%
额定(直流)电压(URdc):100 V尺寸代码:0805
表面贴装:YES温度特性代码:X7R
温度系数:15% ppm/ °C端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状:WRAPAROUNDBase Number Matches:1

C0805Y103K1RAC7800 数据手册

 浏览型号C0805Y103K1RAC7800的Datasheet PDF文件第2页浏览型号C0805Y103K1RAC7800的Datasheet PDF文件第3页浏览型号C0805Y103K1RAC7800的Datasheet PDF文件第4页 
Product Bulletin  
Fail-Safe Floating Electrode MLCC with Flexible Termination  
FF-CAP / X7R Dielectric  
Floating (Cascading) Electrode Internal Design  
Outline Drawing  
Product Description  
The FF-CAP incorporates two existing KEMET technologies; Floating Electrode (cascading electrode  
design) and Flexible Termination. The floating electrode component of these capacitors yields improved  
voltage and ESD performance over standard designs, and also mitigates the risk of low IR or short circuit  
failures associated with mechanical flex cracks. The flexible termination component incorporates a meas-  
ure of flexibility to the capacitor, shifting flex stress away from the ceramic body and into the termination  
area.  
The combination of these technologies ensures an increased measure of protection from board flex,  
offering up to 5mm of flex-bend capability. This provides for an enhanced level of mechanical flex crack pro-  
tection for low to mid capacitance part types.  
Dimensions – Millimeters (Inches)  
EIA Size Metric Size  
L
W
B
S
Code  
0603  
0805  
1206  
1210  
1812  
Code  
1608  
2012  
3216  
3225  
4532  
Length  
Width  
Bandwidth  
Separation  
1.6 (.063) ± 0.20 (.008) 0.8 (.031) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)  
2.1 (.083) ± 0.30 (.012) 1.25 (.049) ± 0.20 (.008) 0.05 (.020) ± 0.25 (.010) 0.75 (.030)  
3.3 (.130) ± 0.30 (.012) 1.6 (.063) ± 0.20 (.008) 0.50 (.020) ± 0.25 (.010)  
3.4 (.134) ± 0.40 (.016) 2.5 (.098) ± 0.20 (.008) 0.50 (.020) ± 0.25 (.010)  
4.6 (.181) ± 0.40 (.016) 3.2 (.126) ± 0.30 (.021) 0.60 (.024) ± 0.35 (.014)  
-
-
-
See “Capacitance Range” tables next page for capacitor chip thickness code specification. Capacitor chip thickness dimensions are detailed in the  
“Thickness Code Reference Chart” on page 4.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
F3282B 9/09  

C0805Y103K1RAC7800 替代型号

型号 品牌 替代类型 描述 数据表
C2012X7R2A103K085AA TDK

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