Datasheet > C0805X106J1RAC3316

C0805X106J1RAC3316

更新时间： 2024-11-15 00:36:59

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
7页	185K
描述
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3-100 VDC, VW 80808 Specification

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

C0805X106J1RAC3316 数据手册

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第2页

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第3页

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第4页

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第5页

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第6页

浏览型号C0805X106J1RAC3316的Datasheet PDF文件第7页

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric,

6.3 – 100 VDC, VW 80808 Speciﬁcation

Overview

Combined with the stability of an X7R dielectric, these ﬂex-robust

KEMET’s Flexible Termination (FT-CAP) multilayer ceramic

capacitor in X7R dielectric incorporates a unique, ﬂexible

termination system that is integrated with KEMET’s standard

termination materials. A conductive silver epoxy is utilized

between the base metal and nickel barrier layers of KEMET’s

standard termination system in order to establish pliability

while maintaining terminal strength, solderability and electrical

performance. This technology was developed in order to

address the primary failure mode of MLCCs– ﬂex cracks, which

are typically the result of excessive tensile and shear stresses

produced during board ﬂexure and thermal cycling. Flexible

termination technology inhibits the transfer of board stress to the

rigid ceramic body, therefore mitigating ﬂex cracks which can

result in low IR or short circuit failures.

devices are RoHS Compliant, offer a 5 mm minimum of ﬂex-bend

and exhibit a predictable change in capacitance with respect to

time and voltage. Capacitance change with reference to ambient

temperature is limited to ±15% from -55°C to +125°C.

In addition of these devices meeting the Automotive Electronics

Council's AEC–Q200 qualiﬁcation requirements, the VW80808

(VW/AUDI) Speciﬁcation approval is also part of this robust

product offering

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide superior

ﬂex performance over standard termination systems.

Ordering Information

1206

106

3316

Case Size Speciﬁcation/ Capacitance

Capacitance

Tolerance

Rated Voltage

(VDC)

Failure Rate/ Termination

Packaging/Grade

(C-Spec)¹

Ceramic

Dielectric

R = X7R

(L" x W")

Series

Code (pF)

Design

Finish

0603

0805

1206

1210

X = Flexible Two signiﬁcant J = ±5%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

A = N/A

C = 100%

Matte Sn

3316 = 7" Reel

Unmarked

3317 = 13" Reel

Unmarked

Termination

digits +

number of

zeros

K = ±10%

M = ±20%

¹Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

Special_VW/AUDI • 1/26/2016

12 3 4 5 6 7

中文翻译

下载PDF

与C0805X106J1RAC3316相关器件

型号	品牌	获取价格	描述	数据表
C0805X106J1RAC3317	KEMET	获取价格	Flexible Termination System (FT-CAP), X7R Dielectric, 6.3-100 VDC, VW 80808 Specification
C0805X106J1RACAUTO	KEMET	获取价格	Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0805X106J1RACTU	KEMET	获取价格	Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)
C0805X106J1RALTU	KEMET	获取价格	Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)
C0805X106J2RACAUTO	KEMET	获取价格	Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0805X106J2RACTU	KEMET	获取价格	Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)
C0805X106J2RALTU	KEMET	获取价格	Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)
C0805X106J3NAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors X8L Dielectric
C0805X106J3NACTU	KEMET	获取价格	Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0805X106J3NAL	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors X8L Dielectric

与C0805X106J1RAC3316相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

5
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

2
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

29
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

12

产品中心

服务支持

精选活动

关于我们

帮助中心

C0805X106J1RAC3316

C0805X106J1RAC3316 数据手册

与C0805X106J1RAC3316相关器件

与C0805X106J1RAC3316相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

C0805X106J1RAC3316

C0805X106J1RAC3316 数据手册

与C0805X106J1RAC3316相关器件

与C0805X106J1RAC3316相关文章

您还可以找

您在本页遇到什么问题？