Datasheet > C0603X6S1A223K030BB_17

C0603X6S1A223K030BB_17

更新时间： 2024-11-05 01:14:19

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	232K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : March 30, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C0603X6S1A223K030BB

TDK item description C0603X6S1A223KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C0603 [EIA 0201]

Production (Not Recommended for New Design)

Size

Length(L)

0.60mm ±0.03mm

Width(W)

0.30mm ±0.03mm

0.10mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.20mm Min.

0.25mm to 0.35mm

0.20mm to 0.30mm

0.25mm to 0.35mm

Electrical Characteristics

Capacitance

22nF ±10%

10VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X6S(±22%)

10%

4545MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Punched (Paper)Taping [180mm Reel]

15000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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