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C0603X221K5RAC7867 PDF预览

C0603X221K5RAC7867

更新时间： 2024-11-24 15:28:59
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
5页 138K
描述
Ceramic Capacitor, Ceramic, 50V, X7R, -/+15ppm/Cel TC, 0.00022uF, 0603

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C0603X221K5RAC7867 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 0603
Reach Compliance Code：compliant风险等级：5.21
电容：0.00022 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.8 mm
JESD-609代码：e3长度：1.6 mm
安装特点：SURFACE MOUNT多层：Yes
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：TR, PAPER, 7 INCH正容差：10%
额定（直流）电压（URdc）：50 V尺寸代码：0603
表面贴装：YES温度特性代码：X7R
温度系数：15% ppm/ °C端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：WRAPAROUND宽度：0.8 mm
Base Number Matches：1

C0603X221K5RAC7867 数据手册

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Product Bulletin  
Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations  
Standard Electrode Internal Design  
Outline Drawing  
The “Flexible Termination (FT-CAP)” capacitor is a surface mount multi-layer ceramic capacitor that incor-  
porates a unique, flexible termination system that is integrated with standard termination materials. A con-  
ductive silver epoxy is utilized between the conductive metallization and nickel barrier finish in order to  
establish pliability while maintaining terminal strength, solderability and electrical performance. This tech-  
nology was developed to address the primary failure mode of MLCC’s, flex cracks, which are typically the  
result of excessive shear stresses produced during board flexure. Flexible termination technology directs  
board flex stress away from the ceramic body and into the conductive epoxy area, therefore mitigating flex  
cracks which can result in low-IR or short-circuit failures. The FT-CAP offers up to 5mm of flex-bend capa-  
bility, complementing our current "Open Mode","Floating Electrode (FE-CAP)"and “Floating Electrode with  
Flexible Termination (FF-CAP)” product lines by providing our customers with a complete portfolio of flex  
solutions.  
Dimensions – Millimeters (Inches)  
EIA Size Metric Size  
L
W
B
S
Code  
0603  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
Code  
1608  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
Length  
Width  
Bandwidth  
Separation  
1.6 (.063) ± 0.20 (.008) 0.8 (.031) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)  
2.1 (.083) ± 0.30 (.012) 1.25 (.049) ± 0.20 (.008) 0.50 (.020) ± 0.25 (.010) 0.75 (.030)  
3.3 (.130) ± 0.30 (.012) 1.6 (.063) ± 0.20 (.008) 0.50 (.020) ± 0.25 (.010)  
3.4 (.134) ± 0.40 (.016) 2.5 (.098) ± 0.20 (.008) 0.50 (.020) ± 0.25 (.010)  
4.7 (.185) ± 0.50 (.020) 2.0 (.079) ± 0.20 (.008) 0.60 (.024) ± 0.35 (.014)  
4.6 (.181) ± 0.40 (.016) 3.2 (.126) ± 0.30 (.021) 0.60 (.024) ± 0.35 (.014)  
4.6 (.181) ± 0.40 (.016) 6.4 (.250) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)  
5.9 (.232) ± 0.75 (.030) 5.0 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)  
5.9 (.232) ± 0.75 (.030) 6.4 (.250) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)  
-
-
-
-
-
-
-
See “Capacitance Range” tables next page for capacitor chip thickness code specification. Capacitor chip thickness dimensions are detailed in the  
“Thickness Code Reference Chart” on page 5.  
F3281E 9/09  
12345

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