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C0603C709K8GAL

更新时间： 2024-11-25 07:36:23
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
8页 176K
描述
Ceramic Capacitor, Multilayer, Ceramic, 10V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.000007uF, Surface Mount, 0603, CHIP

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中文翻译

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C0603C709K8GAL 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active包装说明：, 0603
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.71
电容：0.000007 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMICJESD-609代码：e0
安装特点：SURFACE MOUNT多层：Yes
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE包装方法：BULK CASSETTE; TR, PAPER, 7/13 INCH
正容差：10%额定（直流）电压（URdc）：10 V
尺寸代码：0603表面贴装：YES
温度特性代码：C0G温度系数：-/+30ppm/Cel ppm/ °C
端子面层：Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier端子形状：WRAPAROUND
Base Number Matches：1

C0603C709K8GAL 数据手册

 浏览型号C0603C709K8GAL的Datasheet PDF文件第2页浏览型号C0603C709K8GAL的Datasheet PDF文件第3页浏览型号C0603C709K8GAL的Datasheet PDF文件第4页浏览型号C0603C709K8GAL的Datasheet PDF文件第5页浏览型号C0603C709K8GAL的Datasheet PDF文件第6页浏览型号C0603C709K8GAL的Datasheet PDF文件第7页 
New Product Bulletin  
Tin/Lead “L” Termination Ceramic Chip Capacitors  
KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the  
needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the  
bulk of the electronics industry rapidly marches to RoHS compliance, KEMET realizes the importance of providing  
the Tin/Lead terminated products for our valued high reliability and military customers.  
KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225  
and standard capacitance values in X5R, X7R, and C0G dielectrics. Voltage ratings range from 6.3V to 200V.  
KEMET's Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the  
component. To order the Tin/Lead terminations, indicate an "L" in the 14th digit of the part number. For additional  
dielectrics and voltage ratings please contact the factory or local Sales personnel.  
Applications  
• Military Products  
• Space Quality Products  
• High Reliability Telecommunication Equipment  
Outline Drawing  
L
Sn/Pb PLATE  
W
T
B
NICKEL PLATE  
CONDUCTIVE METALLIZATION  
S
ELECTRODES  
Table 1 – Dimensions - Millimeters (Inches)  
Metric Code  
EIA Size Code  
L - Length  
W - Width  
B - Bandwidth  
Band Separation  
1.0 (.04)  
± .05 (.002)  
0.5 (.02)  
± .05 (.002)  
0.20 (0.008)  
-0.40 (0.016)  
1005  
0402  
0.3 (.012)  
1.6 (.063)  
± 0.15 (.006  
0.8 (.032)  
± 0.15 (.006)  
0.35 (.014)  
± 0.15 (.006)  
1608  
2012  
3216  
3225  
0603  
0805  
1206  
1210  
0.7 (.028)  
0.75 (0.030)  
N/A  
2.0 (0.079)  
± 0.2 (0.008)  
1.2 (0.049  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
3.2 (0.126)  
± 0.2 (0.008)  
1.6 (0.063)  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
3.2 (0.126)  
± 0.2 (0.008)  
2.5 (0.098)  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
N/A  
4.5 (0.177)  
± 0.3 (0.012)  
3.2 (0.126)  
± 0.3 (0.012)  
0.6 (0.024)  
± 0.35 (0.014)  
4532  
4564  
5650  
5664  
1812  
1825  
2220  
2225  
N/A  
N/A  
N/A  
N/A  
4.5 (0.177)  
± 0.3 (0.012)  
6.4 (0.250)  
± 0.4 (0.016)  
0.6 (0.024)  
± 0.35 (0.014)  
5.6 (.220)  
± 0.4 (.016)  
5.0 (.197)  
± 0.4 (.016)  
0.6 (0.024)  
± .35 (0.014)  
5.6 (.220)  
± 0.4 (.016)  
6.3 (.248)  
± 0.4 (.016)  
0.6 (0.024)  
± .35 (0.014)  
Note: For thickness dimensions, see Tables 2 and 3.  
F-9037 08/05  
12345678

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