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C0603C225K8PAC PDF预览

C0603C225K8PAC

更新时间: 2024-11-24 03:47:15
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
2页 42K
描述
Surface Mount Ceramic Chip Capacitors X5R Dielectric

C0603C225K8PAC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:0603
包装说明:, 0603Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8532.24.00.20
风险等级:5.24电容:2.2 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.8 mmJESD-609代码:e3
长度:1.6 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:Bulk
正容差:10%额定(直流)电压(URdc):10 V
尺寸代码:0603表面贴装:YES
温度特性代码:X5R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:0.8 mmBase Number Matches:1

C0603C225K8PAC 数据手册

 浏览型号C0603C225K8PAC的Datasheet PDF文件第2页 
New Product Bulletin  
Surface Mount Ceramic Chip Capacitors  
X5R Dielectric  
KEMET is pleased to continue the expansion of high capacitance ratings in our X5R ceramic  
chip capacitors to include the following values in our base metal electrode devices.  
0603/X5R - 1.2µF (125) – 2.2µF (225) @ 10 Volts  
0805/X5R - 5.6µF (565) – 10.0µF (106) @ 10 Volts  
1206/X5R - 12.0µF (126) – 22.0 (226) @ 10 Volts  
Outline Drawing  
Table 1  
Dimensions - Millimeters (Inches)  
EIA Size Metric Size  
L
W
Width  
B
S - Min.  
Separation  
Mounting  
Technique  
Code  
Code  
Length  
Bandwidth  
1.6 (.063) ±  
0.15 (.006)  
0.8 (.032) ±  
0.15 (.006)  
0.35 (.014) ±  
0.15 (.006)  
Solder Wave  
or Reflow  
0603  
1608  
0.7 (.028)  
0.75 (.030)  
N/A  
2.0 (.079) ±  
0.2 (.008)  
1.25 (.049) ±  
0.2 (.008)  
0.5 (.02) ±  
.25 (.010)  
Solder Wave  
or Reflow  
0805  
1206  
2012  
3216  
3.2 (.126) ±  
0.2 (.008)  
1.6 (.063) ±  
0.2 (.008)  
0.5 (.02) ±  
.25 (.010)  
Solder Wave  
or Reflow  
See Table 2 for thickness dimension.  
F-9034 06/05  

C0603C225K8PAC 替代型号

型号 品牌 替代类型 描述 数据表
C0603C225K8PACTU KEMET

完全替代

Ceramic, Commercial-(CxxxxC), 2.2 uF, 10%, 10 V, 0603, X5R, SMD, MLCC, Temperature Stable,
CC0603KRX5R6BB225 YAGEO

类似代替

通用型陶瓷电容
C1608X5R1A225K080AC TDK

类似代替

CAP CER 2.2UF 10V X5R 0603

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