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C0603C185K8PAC PDF预览

C0603C185K8PAC

更新时间: 2024-11-27 03:47:15
品牌 Logo 应用领域
基美 - KEMET 电容器固定电容器
页数 文件大小 规格书
2页 42K
描述
Surface Mount Ceramic Chip Capacitors X5R Dielectric

C0603C185K8PAC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 0603
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.00.20风险等级:5.54
电容:1.8 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMICJESD-609代码:e3
安装特点:SURFACE MOUNT多层:Yes
负容差:10%端子数量:2
最高工作温度:85 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, PAPER, 7/13 INCH
正容差:10%额定(直流)电压(URdc):10 V
尺寸代码:0603表面贴装:YES
温度特性代码:X5R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
Base Number Matches:1

C0603C185K8PAC 数据手册

 浏览型号C0603C185K8PAC的Datasheet PDF文件第2页 
New Product Bulletin  
Surface Mount Ceramic Chip Capacitors  
X5R Dielectric  
KEMET is pleased to continue the expansion of high capacitance ratings in our X5R ceramic  
chip capacitors to include the following values in our base metal electrode devices.  
0603/X5R - 1.2µF (125) – 2.2µF (225) @ 10 Volts  
0805/X5R - 5.6µF (565) – 10.0µF (106) @ 10 Volts  
1206/X5R - 12.0µF (126) – 22.0 (226) @ 10 Volts  
Outline Drawing  
Table 1  
Dimensions - Millimeters (Inches)  
EIA Size Metric Size  
L
W
Width  
B
S - Min.  
Separation  
Mounting  
Technique  
Code  
Code  
Length  
Bandwidth  
1.6 (.063) ±  
0.15 (.006)  
0.8 (.032) ±  
0.15 (.006)  
0.35 (.014) ±  
0.15 (.006)  
Solder Wave  
or Reflow  
0603  
1608  
0.7 (.028)  
0.75 (.030)  
N/A  
2.0 (.079) ±  
0.2 (.008)  
1.25 (.049) ±  
0.2 (.008)  
0.5 (.02) ±  
.25 (.010)  
Solder Wave  
or Reflow  
0805  
1206  
2012  
3216  
3.2 (.126) ±  
0.2 (.008)  
1.6 (.063) ±  
0.2 (.008)  
0.5 (.02) ±  
.25 (.010)  
Solder Wave  
or Reflow  
See Table 2 for thickness dimension.  
F-9034 06/05  

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