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C0603C182J1GACTM

更新时间： 2024-11-08 10:00:03
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
9页 1079K
描述
CAPACITOR, CERAMIC, MULTILAYER, 100V, C0G, 0.0018uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

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C0603C182J1GACTM 数据手册

 浏览型号C0603C182J1GACTM的Datasheet PDF文件第2页浏览型号C0603C182J1GACTM的Datasheet PDF文件第3页浏览型号C0603C182J1GACTM的Datasheet PDF文件第4页浏览型号C0603C182J1GACTM的Datasheet PDF文件第5页浏览型号C0603C182J1GACTM的Datasheet PDF文件第6页浏览型号C0603C182J1GACTM的Datasheet PDF文件第7页 
CERAMIC CHIP CAPACITORS  
FEATURES  
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics  
• Tape and reel packaging per EIA481-1. (See page  
92 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
• Available Capacitance Tolerances: 0.10 pFꢁ 0.25  
pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and  
+80ꢀ-20ꢀ  
• RoHS Compliant  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
S
EIA SIZE  
CODE  
METRIC  
SIZE CODE  
T
MOUNTING  
TECHNIQUE  
L - LENGTH  
W - WIDTH  
B - BANDWIDTH  
SEPARATION  
minimum  
THICKNESS  
0201*  
0402*  
0603  
0805*  
1206*  
1210*  
1808  
1812  
1825*  
2220  
2225  
0603  
1005  
1608  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
0.6 (.024) ± .03 (.001)  
1.0 (.04) ± .05 (.002)  
1.6 (.063) ± .15 (.006)  
2.0 (.079) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
4.5 (.177) ± .30 (.012)  
4.5 (.177) ± .30 (.012)  
4.5 (.177) ± .30 (.012)  
5.6 (.220) ± .40 (.016)  
5.6 (.220) ± .40 (.016)  
0.3 ± (.012) ± .03 (.001)  
0.5 (.02) ± .05 (.002)  
0.8 (.032) ± .15 (.006)  
1.25 (.049) ± .20 (.008)  
1.6 (.063) ± .20 (.008)  
2.5 (.098) ± .20 (.008)  
2.0 (.079) ± .20 (.008)  
3.2 (.126) ± .30 (.012)  
6.4 (.252) ± .40 (.016)  
5.0 (.197) ± .40 (.016)  
6.3 (.248) ± .40 (.016)  
0.15 (.006) ± .05 (.002)  
0.20 (.008) -.40 (.016)  
0.35 (.014) ± .15 (.006)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.60 (.024) ± .35 (.014)  
0.60 (.024) ± .35 (.014)  
0.60 (.024) ± .35 (.014)  
0.60 (.024) ± .35 (.014)  
0.60 (.024) ± .35 (.014)  
N/A  
0.3 (.012)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Reflow  
Solder Wave +  
or  
Solder Reflow  
See page 78  
for thickness  
dimensions.  
N/A  
N/A  
N/A  
Solder Reflow  
N/A  
N/A  
N/A  
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)  
+ For extended value 1210 case size - solder reflow only.  
(Standard Chips - For  
Military see page 87)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
END METALLIZATION  
SIZE CODE  
C-Standard (Tin-plated nickel barrier)  
SPECIFICATION  
C - Standard  
FAILURE RATE LEVEL  
CAPACITANCE CODE  
A- Not Applicable  
Expressed in Picofarads (pF)  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
B – 0.10pF J – 5ꢀ  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
Change Over Temperature Range  
G – C0G (NP0) ( 30 PPMꢂ/C)  
R – X7R ( 15ꢀ) (-55/C + 125/C)  
P– X5R ( 15ꢀ) (-55/C + 85/C)  
U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)  
C – 0.25pF K – 10ꢀ  
V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)  
D – 0.5pF  
F – 1ꢀ  
G – 2ꢀ  
M – 20ꢀ  
P – (GMV) – special order only  
Z – +80ꢀ, -20ꢀ  
VOLTAGE  
1 - 100V 3 - 25V  
5V  
2 - 200V 4 - 16V  
6V  
5 - 50V 8 - 10V  
0V  
6 - 35V 9 - 6.3V  
7 - 4V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  
3V  
72  
1234567...9

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