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C0402C821M3GAC PDF预览

C0402C821M3GAC

更新时间： 2024-11-20 05:08:03
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
2页 51K
描述
Surface Mount Ceramic Chip Capacitors - C0G Dielectric

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中文翻译

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C0402C821M3GAC 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 0402
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.66
电容：0.00082 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.5 mm
JESD-609代码：e3长度：1 mm
安装特点：SURFACE MOUNT多层：Yes
负容差：20%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：BULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH正容差：20%
额定（直流）电压（URdc）：25 V尺寸代码：0402
表面贴装：YES温度特性代码：C0G
温度系数：30ppm/Cel ppm/ °C端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：WRAPAROUND宽度：0.5 mm
Base Number Matches：1

C0402C821M3GAC 数据手册

 浏览型号C0402C821M3GAC的Datasheet PDF文件第2页 
Product Bulletin  
Surface Mount Ceramic Chip Capacitors – C0G Dielectric  
Outline Drawing  
L
TIN PLATE  
W
T
B
NICKEL PLATE  
S
ELECTRODES  
CONDUCTIVE METALLIZATION  
Dimensions - Millimeters (Inches)  
S
EIA SIZE  
CODE  
METRIC  
SIZE CODE  
MOUNTING  
TECHNIQUE  
L - LENGTH  
W - WIDTH  
B - BANDWIDTH  
SEPARATION  
minimum  
0402  
0603  
0805  
1206  
1210  
1005  
1608  
2012  
3216  
3225  
1.0 (.04) ± .05 (.002)  
1.6 (.063) ± .15 (.006)  
2.0 (.079) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
3.2 (.126) ± .20 (.008)  
0.5 (.02) ± .05 (.002)  
0.8 (.032) ± .15 (.006)  
1.25 (.049) ± .20 (.008)  
1.6 (.063) ± .20 (.008)  
2.5 (.098) ± .20 (.008)  
0.20 (.008) -.40 (.016)  
0.35 (.014) ± .15 (.006)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.50 (.02) ± .25 (.010)  
0.3 (.012)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Reflow  
Solder Wave +  
or  
Solder Reflow  
N/A  
See Capacitance Value Chart below for thickness dimension.  
+ For extended values 1210 case sizes - solder reflow only.  
Electrical Parameters  
As detailed in the KEMET Surface Mount Catalog F3102 for C0G, with following specific requirements based on room  
temperature (25°C) parameters:  
•
•
Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 30 PPM/°C over that range.  
Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1000 megohm microfarads or  
100GΩ, whichever is less.  
•
Capacitance and Dissipation Factor (DF) measured at the following conditions.  
Capacitance - 1 kHz and 1 vrms if capacitance >1000 pF  
1 MHz and 1 vrms if capacitance ≤ 1000 pF  
DF Limit is 0.1%.  
Soldering Process  
These components are suitable for wave and reflow soldering. All parts incorporate the standard KEMET  
barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-  
ance to leaching.  
Marking  
These chips will be supplied unmarked. However, marking is available as an extra cost option.  
Qualification/Certification  
AEC-Q200 Rev. C - Automotive  
RoHS 6 - 100% tin termination  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
F9126 5/07  
12

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C0402C822K3RACTU KEMET

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