Datasheet > C005YJ0R4ABSTR\500

$C005YJ0R4ABSTR\500 PDF预览$

C005YJ0R4ABSTR\500

更新时间： 2023-09-23 07:46:36

品牌	Logo	应用领域
京瓷/艾维克斯 - KYOCERA AVX		/
页数	文件大小	规格书
19页	217K
描述
Thin Film Capacitor

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数据手册

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Accu-F / Accu-P

Application Notes

PREHEAT & SOLDERING

CLEANING RECOMMENDATIONS

The rate of preheat in production should not exceed 4ꢀC/

second and a recommended maximum is about 2ꢀC/second.

Temperature differential from preheat to soldering should not

exceed 100ꢀC.

For further specific application or process advice, please consult

AVX.

Care should be taken to ensure that the devices are

thoroughly cleaned of flux residues, especially the space

beneath the device. Such residues may otherwise become

conductive and effectively offer a lossy bypass to the device.

Various recommended cleaning conditions (which must be

optimized for the flux system being used) are as follows:

Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,

water and other standard PCB

COOLING

cleaning liquids.

After soldering, the assembly should preferably be allowed

to cool naturally. In the event of assisted cooling, similar

conditions to those recommended for preheating should be

used.

Ultrasonic conditions . . power-20w/liter max.

frequency-20kHz to 45kHz.

Temperature . . . . . . . . . 80ꢀC maximum (if not otherwise

limited by chosen solvent system).

Time . . . . . . . . . . . . . . . 5 minutes max.

HAND SOLDERING & REWORK

Hand soldering is permissible. Preheat of the PCB to 150ꢀC is

required. The most preferable technique is to use hot air sol-

dering tools. Where a soldering iron is used, a temperature

controlled model not exceeding 30 watts should be used and

set to not more than 260ꢀC.

STORAGE CONDITIONS

Recommended storage conditions for Accu-F^®and

Accu-P^®prior to use are as follows:

Temperature . . . . . . . . . . 15ꢀC to 35ꢀC

Humidity . . . . . . . . . . . . . ≤65ꢁ

Air Pressure . . . . . . . . . . 860mbar to 1060mbar

RECOMMENDED SOLDERING

PROFILE

IR REFLOW

WAVE SOLDERING

3–5 seconds

220

260

240

220

200

180

160

140

120

100

Assembly exits heat–

210

200

190

180

170

160

150

140

130

120

110

100

no forced cooldown

100°C

Additional soak time

to allow uniform

heating of the

substrate

Natural

Cooling

186°C solder melting

temperature

Assembly enters the

preheat zone

45-60 sec.

above solder

melting point

Enter Wave

Time (seconds)

Soak time

1) Activates the flux

2) Allows center of board

temperatures to catch up with

corners

90 100 110 120

0.5

1.5

2.5

3.5

4.5

Time (mins)

VAPOR PHASE

Transfer from

preheat with

min. delay &

temp. loss

Preheat

Reflow

215°C

200

180

160

140

120

100

200

180

160

140

120

100

Duration varies

Natural

Cooling

with thermal mass

of assembly

10–60 secs typical

Enter

Vapor

Time (minutes)

Time (seconds)

1...15 16 171819

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