Datasheet > BZX84C2V4W_15

BZX84C2V4W_15

更新时间： 2024-11-30 01:16:51

品牌	Logo	应用领域
美台 - DIODES		/
页数	文件大小	规格书
4页	159K
描述
200mW SURFACE MOUNT ZENER DIODE

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中文翻译

获取价格

数据手册

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BZX84C2V4W_15 数据手册

BZX84C2V4W - BZX84C39W

200mW SURFACE MOUNT ZENER DIODE

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Features

Mechanical Data

•

Planar Die Construction

200mW Power Dissipation

Zener Voltages from 2.4V – 39V

Ultra-Small Surface Mount Package

Lead Free/RoHS Compliant (Note 4)

"Green" Device (Notes 1 and 2)

•

Case: SOT-323

Case Material: Molded Plastic, "Green" Molding Compound,

Note 2. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Polarity: See Diagram

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.006 grams (approximate)

Top View

Device Schematic

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage

@ I_{F =}10mA

V_F

Thermal Characteristics

Characteristic

Power Dissipation (Note 3)

Symbol

P_D

Value

200

Unit

K/W

Thermal Resistance, Junction to Ambient Air (Note 3)

Operating and Storage Temperature Range

625

R_θ

-65 to +125

T_J, T_STG

°C

Notes:

1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.

2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

4. No purposefully added lead.

1 of 4

www.diodes.com

May 2008

BZX84C2V4W - BZX84C39W

Document number: DS30066 Rev. 15 - 2

12 3 4

中文翻译

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