Datasheet > BZX84C2V4S_08

BZX84C2V4S_08

更新时间： 2024-11-28 09:06:19

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
4页	155K
描述
DUAL 200mW SURFACE MOUNT ZENER DIODE

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中文翻译

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BZX84C2V4S_08 数据手册

BZX84C2V4S - BZX84C39S

DUAL 200mW SURFACE MOUNT ZENER DIODE

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Features

Mechanical Data

•

Planar Die Construction

200mW Power Dissipation

Zener Voltages from 2.4V - 39V

Ultra-Small Surface Mount Package

Lead Free/RoHS Compliant (Note 2)

"Green" Device (Note 3 and 4)

•

Case: SOT-363

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Polarity: See Diagram

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.006 grams (approximate)

C₁

A₁

A₂

C₂

Top View

Device Schematic

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage

@ I_F= 10mA

V_F

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 1)

200

P_D

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

625

°C/W

°C

R_θ

-65 to +150

T_J,T_STG

Notes:

1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

1 of 4

www.diodes.com

May 2008

BZX84C2V4S - BZX84C39S

Document number: DS30108 Rev. 17 - 2

12 3 4

中文翻译

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