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BZX84B12-TP-HF PDF预览

BZX84B12-TP-HF

更新时间: 2024-12-01 12:58:55
品牌 Logo 应用领域
美微科 - MCC 二极管齐纳二极管
页数 文件大小 规格书
6页 299K
描述
Zener Diode,

BZX84B12-TP-HF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:R-PDSO-G3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.11Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODEJESD-30 代码:R-PDSO-G3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.35 W标称参考电压:12 V
表面贴装:YES技术:ZENER
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:10最大电压容差:2%
工作测试电流:5 mABase Number Matches:1

BZX84B12-TP-HF 数据手册

 浏览型号BZX84B12-TP-HF的Datasheet PDF文件第2页浏览型号BZX84B12-TP-HF的Datasheet PDF文件第3页浏览型号BZX84B12-TP-HF的Datasheet PDF文件第4页浏览型号BZX84B12-TP-HF的Datasheet PDF文件第5页浏览型号BZX84B12-TP-HF的Datasheet PDF文件第6页 
BZX84C2V4  
THRU  
BZX84C(B)51  
M C C  
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20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Silicon  
Features  
Planar Die construction  
350 mWatt  
Zener Diodes  
350mW Power Dissipation  
Zener Voltages from 2.4V - 51V  
Ideally Suited for Automated Assembly Processes  
Mechanical Data  
SOT-23  
Case Material:Molded Plastic. UL Flammability  
A
D
Classification Rating 94V-0 and MSL Rating 1  
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
RoHS Compliant. See ordering information)  
B
C
Weight: 0.008 grams (approx.)  
F
E
Maximum Ratings @ 25oC Unless Otherwise Specified  
Maximum Forward  
Voltage@IF=10mA  
Power Dissipation  
(NoteA)  
Operation And  
Storage  
Temperature  
VF  
0.9  
V
H
G
J
L
K
P(AV)  
350  
mWatt  
DIMENSIONS  
MM  
TJ, TSTG -55oC to  
+150oC  
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
Peak Forward Surge  
Current(NoteB)  
2.0  
A
I
FSM  
F
G
H
J
Thermal Resistance  
(Note C)  
o
357  
Rthja  
C/W  
.085  
.37  
K
L
.007  
.020  
.20  
.50  
NOTES:  
A. Mounted on 5.0mm2(.013mm thick) land areas.  
B. Measured on 8.3ms, single half sine-wave or  
equivalent square wave, duty cycle = 4 pulses per  
minute maximum.  
C. Valid provided the terminals are kept at ambient  
temperature  
Suggested Solder  
Pad Layout  
.031  
.800  
.035  
.900  
.079  
2.000  
inches  
mm  
*Pin Configuration - Top View  
.037  
.950  
.037  
.950  
www.mccsemi.com  
Revision: 13  
2009/04/09  
1 of 6  

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