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BZT52C9V1S PDF预览

BZT52C9V1S

更新时间: 2024-11-13 22:56:43
品牌 Logo 应用领域
美微科 - MCC 稳压二极管齐纳二极管
页数 文件大小 规格书
4页 411K
描述
200 mW Zener Diodes 2.4 to 39 Volts

BZT52C9V1S 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Active包装说明:R-PDSO-F2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.11Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODEJESD-30 代码:R-PDSO-F2
JESD-609代码:e0元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性:UNIDIRECTIONAL
最大功率耗散:0.2 W认证状态:Not Qualified
标称参考电压:9.1 V表面贴装:YES
技术:ZENER端子面层:TIN LEAD
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:30最大电压容差:6.08%
工作测试电流:5 mABase Number Matches:1

BZT52C9V1S 数据手册

 浏览型号BZT52C9V1S的Datasheet PDF文件第2页浏览型号BZT52C9V1S的Datasheet PDF文件第3页浏览型号BZT52C9V1S的Datasheet PDF文件第4页 
BZT52C2V4S  
THRU  
BZT52C39S  
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21201 Itasca Street Chatsworth  
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Features  
200 mW  
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Planar Die construction  
200mW Power Dissipation  
Zener Voltages from 2.4V - 39V  
Zener Diodes  
2.4 to 39 Volts  
Ideally Suited for Automated Assembly Processes  
Mechanical Data  
SOD323  
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Case: SOD-323 Molded Plastic  
Terminals: Solderable per MIL-STD-202, Method 208  
Approx. Weight: 0.008 gram  
A
B
Mounting Position: Any  
Storage & Operating Junction Temperature: -55oC to +150oC  
C
E
Maximum Ratings @ 25oC Unless Otherwise Specified  
Zener Current  
Maximum Forward  
Voltage  
IF  
VF  
100  
1.2  
mA  
V
F
D
Power Dissipation  
(Notes A)  
Peak Forward Surge  
Current (Notes B)  
P(AV)  
200  
2.0  
mWatt  
Amps  
G
IFSM  
NOTES:  
DIMENSIONS  
MM  
A. Mountedon5.0mm2(.013mmthick)landareas.  
B. Measured on 8.3ms, single half sine-wave or equivalent  
squarewave, dutycycle=4pulsesperminutemaximum.  
DIM  
INCHES  
MIN  
NOTE  
MAX  
.107  
.078  
.054  
.038  
.014  
.006  
---  
MIN  
2.30  
1.75  
1.15  
0.70  
0.25  
0.05  
0.30  
MA X  
2.70  
1.95  
1.35  
0.95  
0.35  
0.15  
---  
A
B
C
D
E
F
.090  
.068  
.045  
.027  
.009  
.002  
.012  
G
SUGGESTED SOLDER  
PAD LAYOUT  
0.059"  
0.039”  
0.031”  
www.mccsemi.com  

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