Datasheet > BZT52C4V3

BZT52C4V3

更新时间： 2023-12-06 19:45:36

品牌	Logo	应用领域
鲁光 - LGE		稳压二极管
页数	文件大小	规格书
3页	1679K
描述
稳压二极管

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数据手册

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BZT52C4V3 数据手册

BZT52C2V0-BZT52C51

Surface Mount Zener Diodes

SOD-123

0.022(0.55)

Typ. Min.

0.053(1.35)

Max.

Features

0.152(3.85)

0.140(3.55)

0.112(2.85)

0.100(2.55)

Planar die construction.

500mW power dissipation on ceramic

PCB.

0.010(0.25)

Min.

0.067(1.70)

0.055(1.40)

General purpose, medium current.

0.006(0.15)

Typ. Min.

Ideally suited for automated assembly processes.

0.004(0.10)

Max.

Applications

Dimensions in inches and (millimeters)

Zener diode.

Ultra-small surface mount package.

Ordering Information

Type No.

Marking

Package Code

SOD-123

BZT52C2V4-BZT52C51

See table 2

MAXIMUM RATING @ Ta=25℃ unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage

@ I_F=10mA

V_F

0.9

Power Dissipation

P_d

500

℃/W

℃

Thermal resistance,junction to ambient air

Junction temperature

R_θjA

305

T_j

150

Storage temperature range

T_stg

-65-150

℃

Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm²

2. Short duration test pulse used to minimize self-heating effect.

3. When provided, otherwise, parts are provided with date code only, and type number

identifications appears on reel only.

4. f = 1KHz

http://www.lgesemi.com

mail:lge@lgesemi.com

Revision:20170701-P1

12 3

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