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BZT52C43_08 PDF预览

BZT52C43_08

更新时间: 2024-11-23 09:04:31
品牌 Logo 应用领域
美台 - DIODES 稳压二极管
页数 文件大小 规格书
3页 97K
描述
SURFACE MOUNT ZENER DIODE

BZT52C43_08 数据手册

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BZT52C43 - BZT52C51  
SURFACE MOUNT ZENER DIODE  
Please click here to visit our online spice models database.  
Mechanical Data  
Features  
Planar Die Construction  
General Purpose, Medium Current  
Ideally Suited for Automated Assembly Processes  
Lead, Halogen and Antimony Free, RoHS Compliant  
"Green" Device (Notes 5 and 6)  
Case: SOD-123  
Case Material: Molded Plastic. UL Flammability Classification  
Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Solderable per MIL-STD-202, Method 208  
Lead Free Plating (Matte Tin Finish annealed over Alloy 42  
leadframe)  
Polarity: Cathode Band  
Marking Information: See Page 2  
Ordering Information: See Page 2  
Weight: 0.01 grams (approximate)  
Top View  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 1)  
Symbol  
Value  
410  
Unit  
mW  
°C/W  
°C  
PD  
Thermal Resistance, Junction to Ambient Air (Note 1)  
Operating and Storage Temperature Range  
305  
Rθ  
JA  
-65 to +150  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Maximum  
Reverse  
Current  
(Note 2)  
Zener Voltage Range  
(Note 2)  
Maximum Zener Impedance (Note 4)  
Type  
Number  
Marking Code  
(Note 3)  
VZ @ IZT  
IZT  
ZZT @ IZT  
ZZK @ IZK  
IZK  
IR  
@ VR  
Nom  
(V)  
Min (V) Max (V)  
mA  
mA  
uA  
V
Ω
BZT52C43  
BZT52C47  
BZT52C51  
WU/WU  
WV/WZ  
WW/X1  
43  
47  
51  
40.0  
44.0  
48.0  
46.0  
50.0  
54.0  
5
5
5
100  
100  
100  
2
700  
750  
750  
1.0  
1.0  
1.0  
0.1  
0.1  
0.1  
32  
35  
38  
Notes:  
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm .  
2. Short duration pulse test used to minimize self-heating effect.  
3. When provided, otherwise, parts are provided with date code only, and type number identification appears on reel only.  
4. f = 1kHz.  
5. No purposefully added lead. Halogen and Antimony Free.  
6. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
1 of 3  
www.diodes.com  
June 2008  
© Diodes Incorporated  
BZT52C43 - BZT52C51  
Document number: DS30363 Rev. 11 - 2  

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