Datasheet > BUF05704AIPWPR

BUF05704AIPWPR

更新时间： 2022-10-18 00:37:58

品牌	Logo	应用领域
BB		/
页数	文件大小	规格书
25页	368K
描述
18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER

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BUF05704AIPWPR 数据手册

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PWP (R−PDSO−G28)

THERMAL INFORMATION

This PowerPADt package incorporates an exposed thermal pad that is designed to be attached directly to an

external heatsink. When the thermal pad is soldered direct ly to the printed circuit board (PCB), the PCB can be

used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a

ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from

the integrated circuit (IC).

For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,

refer to Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002

and Application Brief, PowerPAD Made Easy , Texas Instruments Literature No. SLMA004. Both documents are

available at www.ti.com.

The exposed thermal pad dimensions for this package are shown in the following illustration.

Exposed Thermal Pad

2,35

1,60

6,46

5,35

Top View

NOTE: All linear dimensions are in millimeters

PPTD032

Exposed Thermal Pad Dimensions

PowerPAD is a trademark of Texas Instruments

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