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BU52098GWZ-E2 PDF预览

BU52098GWZ-E2

更新时间： 2024-01-05 20:35:53
品牌 Logo 应用领域
罗姆 - ROHM 输出元件传感器换能器
页数 文件大小 规格书
18页 855K
描述
Hall Effect Sensor,

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BU52098GWZ-E2 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：BGA4,2X2,16Reach Compliance Code：compliant
风险等级：2.32其他特性：CMOS OUTPUT
主体宽度：0.8 mm主体高度：0.4 mm
主体长度或直径：0.8 mm滞后：1.6 mT
最大磁场范围：27.5 mT最小磁场范围：18.9 mT
安装特点：SURFACE MOUNT轴数：1
端子数量：4最高工作温度：85 °C
最低工作温度：-40 °C输出电路类型：TRANSISTOR
最大输出电流：0.5 mA输出范围：0.2-1.6V
输出类型：VOLTAGE OUTPUT封装主体材料：PLASTIC/EPOXY
封装等效代码：BGA4,2X2,16封装形状/形式：SQUARE
传感器/换能器类型：MAGNETIC FIELD SENSOR,HALL EFFECT最大供电电压：3.6 V
最小供电电压：1.65 V表面贴装：YES
端接类型：SOLDERBase Number Matches：1

BU52098GWZ-E2 数据手册

 浏览型号BU52098GWZ-E2的Datasheet PDF文件第7页浏览型号BU52098GWZ-E2的Datasheet PDF文件第8页浏览型号BU52098GWZ-E2的Datasheet PDF文件第9页浏览型号BU52098GWZ-E2的Datasheet PDF文件第11页浏览型号BU52098GWZ-E2的Datasheet PDF文件第12页浏览型号BU52098GWZ-E2的Datasheet PDF文件第13页 
BU52098GWZ  
Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size  
and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
www.rohm.com  
TSZ02201-0M2M0F416050-1-2  
8.Aug.2016 Rev.001  
© 2016 ROHM Co., Ltd. All rights reserved.  
10/14  
TSZ22111 • 15 • 001  
1...78910111213...18

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