是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | LSSOP, TSOP5/6,.11,37 | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.17 |
其他特性: | DETECTION THRESHOLD VOLTAGE IS 1.3V | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PDSO-G5 |
JESD-609代码: | e2 | 长度: | 2.9 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 5 | 最高工作温度: | 125 °C |
最低工作温度: | -25 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LSSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.25 mm | 子类别: | Power Management Circuits |
最小供电电压 (Vsup): | 0.9 V | 标称供电电压 (Vsup): | 2.4 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Copper (Sn/Cu) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 阈值电压标称: | +1.3V |
处于峰值回流温度下的最长时间: | 10 | 宽度: | 1.6 mm |
Base Number Matches: | 1 |
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