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BS616LV2016EAP55 PDF预览

BS616LV2016EAP55

更新时间: 2024-01-10 15:00:20
品牌 Logo 应用领域
BSI 静态存储器
页数 文件大小 规格书
10页 168K
描述
SRAM

BS616LV2016EAP55 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

BS616LV2016EAP55 数据手册

 浏览型号BS616LV2016EAP55的Datasheet PDF文件第2页浏览型号BS616LV2016EAP55的Datasheet PDF文件第3页浏览型号BS616LV2016EAP55的Datasheet PDF文件第4页浏览型号BS616LV2016EAP55的Datasheet PDF文件第5页浏览型号BS616LV2016EAP55的Datasheet PDF文件第6页浏览型号BS616LV2016EAP55的Datasheet PDF文件第7页 
Very Low Power CMOS SRAM  
128K X 16 bit  
BS616LV2016  
Pb-Free and Green package materials are compliant to RoHS  
n FEATURES  
ŸWide VCC operation voltage : 2.4V ~ 5.5V  
n DESCRIPTION  
The BS616LV2016 is a high performance, very low power CMOS  
Static Random Access Memory organized as 131,072 by 16 bits and  
operates form a wide range of 2.4V to 5.5V supply voltage.  
Advanced CMOS technology and circuit techniques provide both  
high speed and low power features with typical CMOS standby  
current of 0.1uA at 3.0V/25OC and maximum access time of 55ns at  
3.0V/125OC.  
ŸVery low power consumption :  
VCC = 3.0V  
VCC = 5.0V  
Operation current : 30mA (Max.) at 55ns  
2mA (Max.) at 1MHz  
Standby current : 0.1uA (Typ.) at 25 OC  
Operation current : 62mA (Max.) at 55ns  
8mA (Max.) at 1MHz  
Standby current : 0.6uA (Typ.) at 25OC  
ŸHigh speed access time :  
Easy memory expansion is provided by an active LOW chip enable  
(CE) and active LOW output enable (OE) and three-state output  
drivers.  
-55  
-70  
55ns(Max.) at VCC=3.0~5.5V  
70ns(Max.) at VCC=2.7~5.5V  
ŸAutomatic power down when chip is deselected  
ŸEasy expansion with CE and OE options  
ŸI/O Configuration x8/x16 selectable by LB and UB pin.  
ŸThree state outputs and TTL compatible  
ŸFully static operation  
The BS616LV2016 has an automatic power down feature, reducing  
the power consumption significantly when chip is deselected.  
The BS616LV2016 is available in DICE form, JEDEC standard  
44-pin TSOP II package.  
ŸData retention supply voltage as low as 1.5V  
n POWER CONSUMPTION  
POWER DISSIPATION  
STANDBY  
Operating  
PRODUCT  
FAMILY  
OPERATING  
TEMPERATURE  
PKG TYPE  
(ICC, Max)  
(IC CSB1, Typ.)  
(ICCSB1, Max)  
VCC=5.0V  
1MHz fM ax.  
VCC=3.0V  
VCC=5.0V VCC=3.0V VCC=5.0V VCC=3.0V  
1MHz  
fM ax.  
Automotive  
Grade  
BS616LV2016EA  
0.6uA  
0.1uA  
25uA  
15uA  
8mA  
62mA  
2mA  
30mA TSOP II-44  
-40OC to +125OC  
n PIN CONFIGURATIONS  
n BLOCK DIAGRAM  
A11  
A10  
A9  
A4  
A3  
A2  
A1  
A0  
1
2
3
4
5
6
7
8
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
A5  
A6  
A7  
OE  
UB  
LB  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
Address  
Input  
1024  
Memory Array  
1024 x 2048  
10  
Row  
Decoder  
CE  
Buffer  
DQ0  
DQ1  
DQ2  
DQ3  
VCC  
VSS  
DQ4  
DQ5  
DQ6  
DQ7  
WE  
DQ15  
DQ14  
DQ13  
DQ12  
VSS  
VCC  
DQ11  
DQ10  
DQ9  
DQ8  
NC  
A8  
A9  
A10  
A11  
NC  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
BS616LV2016EC  
BS616LV2016EI  
2048  
DQ0  
Data  
Input  
16  
Column I/O  
16  
.
.
Buffer  
.
.
.
.
Write Driver  
Sense Amp  
A16  
A15  
A14  
A13  
16  
.
.
.
.
16  
Data  
Output  
Buffer  
.
.
128  
A12  
22  
23  
Column Decoder  
DQ15  
7
CE  
WE  
OE  
UB  
LB  
Address Input Buffer  
Control  
A12 A13 A14 A15 A16  
A1  
A0  
VCC  
VSS  
Brilliance Semiconductor, Inc.  
reserves the right to change products and specifications without notice.  
R0201-BS66LV2016A  
Revision 1.2A  
1
Mar.  
2006  

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